Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
HiSilicon |
Type: |
Honor KIRIN980 |
Year Released: |
2018 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8.2-A |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A76 + 4x ARM Cortex-A55 MPcore |
Buses:
|
Memory Interface(s): |
LPDDR4x SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
2133 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
4 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
34.13 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1![UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2600 MHz max. |
Cache Memories:
|
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
2560 Kbyte L2 |
Total L3 Cache: |
4096 Kbyte L3 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
7 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Number of Transistors Integrated: |
6900000000 |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G76 GPU |
Number of GPU cores: |
10-core GPU |
GPU Clock: |
720 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, GPRS Class 12
, GPRS Multi-slot Class 33
, EDGE (Class unspecified)
, EDGE Multi-slot Class 12
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 1.46 Mbps (Cat. 2)
, HSUPA 2.0 Mbps (Cat. 5)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSDPA 1.8 Mbps (Cat. 4)
, HSDPA 3.6 Mbps (Cat. 6)
, HSDPA 7.2 Mbps (Cat. 8)
, HSDPA 10.2 Mbps (Cat. 9)
, HSDPA 14.4 Mbps (Cat. 10)
, HSPA+ 21.1 Mbps (Cat. 18)
, HSPA+ 28.8 Mbps (Cat. 16)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, cdmaOne (IS-95)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, TD-SCDMA
, TD-HSDPA
, LTE (Cat. unspecified)
, LTE 50 Mbps / 25 Mbps (Cat. 2)
, LTE 75 Mbps / 25 Mbps (Cat. 3)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 225 Mbps / 50 Mbps
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 75 Mbps (Cat. 5)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 50 Mbps (LTE Cat. 9)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 50 Mbps (LTE Cat. 11)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12)
, LTE 750 Mbps / 225 Mbps (LTE Cat. 15)
, LTE 1 Gbps / 100 Mbps (LTE Cat. 16)
, LTE 1.2 Gbps / 200 Mbps (LTE Cat. 18)
, LTE 1.4 Gbps / 300 Mbps (LTE Cat. 21) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
B1I
, B2a BeiDou receiver |
Additional Information:
|
Special Features: dual ARM Cortex-A76 (up to 2.6 GHz, 512 Kbyte L2 cache per core) + dual ARM Cortex-A76 (up to 1.92 GHz, 512 Kbyte L2 cache per core) + quad ARM Cortex-A55 (up to 1.8 GHz, 128 Kbyte L2 cache per core) Harvard Superscalar processor cores, ARM big.LITTLE, HMP, GSM / GPRS Class 33 / EDGE / CDMA / W-CDMA / HSPA+ 42.2 Mbps / HSUPA 5.76 / TD-SCDMA / LTE-TDD / LTE-FDD Cat. 21. baseband modem, dual Cambricon-1A Neural Network Processing Units (NPU), i8 co-processor, Tensilica HiFi 4 DSP, dual SIM support (DSDA, DSDS), dual 42 MP 14-bit ISP, 2160p30 video encode, 2160p60 video decode, HDR10 support, USB 3.1, Bluetooth 5.0, OpenCL 1.2, Vulkan 1.0, OpenGL ES 3.2, DirectX 12, OpenVG 1.1 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2018-09-11 22:19 |