Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
MediaTek |
Type: |
Dimensity 8300-Ultra MT6897 |
Year Released: |
2023 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv9-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A715 + 4x ARM Cortex-A510 MPcore |
Buses:
|
Memory Interface(s): |
LPDDR5X SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
4266 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
4 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
68.26 Gbyte/s |
Non-volatile Memory Interface |
UFS 4.0![UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
3350 MHz max. |
Cache Memories:
|
Total L3 Cache: |
4096 Kbyte L3 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
4 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G615 GPU |
Number of GPU cores: |
6-core GPU |
GPU Clock: |
1400 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, EDGE (Class unspecified)
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 1.46 Mbps (Cat. 2)
, HSUPA 2.0 Mbps (Cat. 5)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSDPA 1.8 Mbps (Cat. 4)
, HSDPA 3.6 Mbps (Cat. 6)
, HSDPA 7.2 Mbps (Cat. 8)
, HSDPA 10.2 Mbps (Cat. 9)
, HSDPA 14.4 Mbps (Cat. 10)
, HSPA+ 21.1 Mbps (Cat. 18)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, TD-SCDMA
, LTE (Cat. unspecified)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12)
, LTE 1 Gbps / 100 Mbps (LTE Cat. 16)
, LTE 1.2 Gbps / 200 Mbps (LTE Cat. 18)
, LTE 1.6 Gbps (LTE Cat. 19)
, NR 2.6 Gbps
, NR 3.7 Gbps
, NR 4.6 Gbps data links |
Communication Interfaces:
|
Supported USB Specification: |
USB 2.0
, USB 3.0 / USB 3.1 Gen 1 / USB 3.2 Gen 1x1
, USB 3.1 Gen 2 / USB 3.2 Gen 2x1![Released in July, 2013, USB 3.1 Gen 2 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0. Later renamed as USB 3.2 Gen 2x1 Released in July, 2013, USB 3.1 Gen 2 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0. Later renamed as USB 3.2 Gen 2x1](icons/10x10/info_gray.gif) |
Bluetooth support |
Bluetooth 5.4![Two of the major improvements are Periodic Advertising with Responses (PAwR) and Encrypted Advertising Data. Released in Febr, 2023. Two of the major improvements are Periodic Advertising with Responses (PAwR) and Encrypted Advertising Data. Released in Febr, 2023.](icons/10x10/info_gray.gif) |
Wireless LAN support |
IEEE 802.11a
, IEEE 802.11b
, IEEE 802.11g
, IEEE 802.11n
, IEEE 802.11ac
, IEEE 802.11ax (Wi-Fi 6)![Also known as Wi-Fi 6. Supports all ISM bands from 1 to 6 GHz. Subtype of Wi-Fi 6E uses 6 GHz carrier frequency Also known as Wi-Fi 6. Supports all ISM bands from 1 to 6 GHz. Subtype of Wi-Fi 6E uses 6 GHz carrier frequency](icons/10x10/info_gray.gif) |
NFC support |
NFC A
, NFC B![ISO/IEC 14443 Type B ISO/IEC 14443 Type B](icons/10x10/info_gray.gif) |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
E1
, E5a![Galileo E5a band centered at 1176.45MHz, uses QPSK(10) modulation Galileo E5a band centered at 1176.45MHz, uses QPSK(10) modulation](icons/10x10/info_gray.gif) |
Supported GLONASS protocol(s) |
L1OF
, L2OF![GLONASS L2OF FDMA signal centered at 1246 MHz, features a BPSK(0.5) modulation GLONASS L2OF FDMA signal centered at 1246 MHz, features a BPSK(0.5) modulation](icons/10x10/info_gray.gif) |
Supported BeiDou system (BDS) |
B1c
, B1I
, B2a
, B3I BeiDou receiver |
Additional Information:
|
Special Features: 1x ARM Cortex-A715 (up to 3.35 GHz) + 3x ARM Cortex-A715 (up to 3.2 GHz) + 4x ARM Cortex-A510 (up to 2.2 GHz) Harvard Superscalar processor core, HMP, MiraVision 880, 180 Hz FHD+ / 120 Hz WQHD+ display support, 5G NR dual-SIM support, 2160p 60 fps HDR10 video encode, 2160p 60 fps HDR10 video decode, FM radio support, 320 MP single camera support. MediaTek HyperEngine, APU 780. Wi.Fi 6E support, OpenCL 2.0, OpenGL ES 3.2, DirectX 12, Vulkan 1.3. For smartphone devices. |
Datasheet Attributes:
|
Data Integrity |
Final |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2024-05-14 11:27 |