Generel Characteristics: |
Designer |
HiSilicon |
Type: |
Honor KIRIN970 |
Year Released: |
2017 |
Function |
Multi-core Application Processor with Modem |
Architecture: |
Width of Machine Word |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Type of processor core(s) |
4x ARM Cortex-A73 + 4x ARM Cortex-A53 MPcore |
Number of processor core(s): |
octa-core |
Buses: |
Memory Interface(s): |
LPDDR4 SDRAM |
Max. Clock Frequency of Memory IF |
1866 MHz |
Data Bus Width |
16 bit |
Number of data bus channels: |
4 ch |
Max. Data Rate |
29.86 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1 |
Clock Frequencies: |
Recommended Maximum Clock Frequency: |
2360 MHz max. |
Cache Memories: |
L1 Instruction Cache per Core |
64 Kbyte I-Cache |
L1 Data Cache per Core |
64 Kbyte D-Cache |
Total L2 Cache |
2048 Kbyte L2 |
Technology and Packaging: |
Feature Size |
10 nm |
Semiconductor Technology: |
CMOS |
Number of Transistors Integrated: |
5500000000 |
Fab |
TSMC |
Graphical Subsystem: |
Embedded GPU |
ARM Mali-G72 GPU |
Number of GPU cores: |
12-core GPU |
GPU Clock: |
767 MHz GPU |
Cellular Communication: |
Supported Cellular Data Links |
CSD
, GPRS
, GPRS MSC33
, EDGE
, UMTS
, HSUPA
, HSUPA 5.8
, HSDPA
, HSPA+ 42.2
, DC-HSDPA 42.2
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 100/50
, LTE 150/50
, LTE 300/50
, LTE 300/100
, LTE 400/150
, LTE 450/100
, LTE 600/100
, LTE 1000/100
, LTE 1200/200 data links |
Additional Information: |
Special Features: quad ARM Cortex-A73 (up to 2.4 GHz) + quad ARM Cortex-A53 (up to 1.84 GHz) Harvard Superscalar processor cores, ARM big.LITTLE, HMP, GSM / GPRS Class 33 / EDGE / CDMA / W-CDMA / HSPA+ 42.2 Mbps / HSUPA 5.76.. ›› |
Datasheet Attributes: |
Data Integrity |
Preliminary |
Added |
2017-08-19 14:18 |