Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
HiSilicon |
Type: |
Honor KIRIN710A |
Year Released: |
2020 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A73 + 4x ARM Cortex-A53 MPcore |
Buses:
|
Memory Interface(s): |
mobile (LP) DDR4 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
1866 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
2 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
29.86 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1![UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Minimum Clock Frequency: |
480 MHz min. |
Recommended Maximum Clock Frequency: |
2000 MHz max. |
Cache Memories:
|
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
512 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
14 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G51 GPU |
Number of GPU cores: |
4-core GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, GPRS Multi-slot Class 33
, EDGE (Class unspecified)
, HSUPA (Cat. unspecified)
, HSUPA 5.76 Mbps (Cat. 6)
, HSDPA (Cat. unspecified)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, cdmaOne (IS-95)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, TD-SCDMA
, TD-HSDPA
, LTE (Cat. unspecified)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 75 Mbps (Cat. 5)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 50 Mbps (LTE Cat. 9)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 50 Mbps (LTE Cat. 11)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
B1I BeiDou receiver |
Additional Information:
|
Special Features: quad ARM Cortex-A73 (up to 1997 MHz) + quad ARM Cortex-A53 (up to 1667 MHz) Harvard Superscalar processor cores, ARM big.LITTLE, HMP, GSM / GPRS Class 33 / EDGE / CDMA / W-CDMA / HSPA+ 42.2 Mbps / HSUPA 5.76 / TD-SCDMA / LTE-TDD / LTE-FDD Cat 13. baseband modem, dual SIM support (DSDA, DSDS), Tensilica HiFi 4 DSP, 1080p video encode, 2160p video decode, GPU Turbo, OpenCL 2.0, Vulkan 1.0, DirectX 12 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2020-11-02 17:53 |