Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
HiSilicon |
Type: |
KIRIN9000S 4G Hi36A0 |
Year Released: |
2023 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x HiSilicon Taishan V120 + 4x ARM Cortex-A510 MPcore |
Buses:
|
Memory Interface(s): |
LPDDR4x SDRAM
, LPDDR5 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
2750 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
4 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
44 Gbyte/s |
Non-volatile Memory Interface |
UFS 3.1
, UFS 4.0![UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2620 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
7 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
SMIC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
HiSilicon Maleoon 910 GPU |
Number of GPU cores: |
4-core GPU |
GPU Clock: |
750 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, GPRS Class 10
, GPRS Class 12
, GPRS Multi-slot Class 12
, GPRS Multi-slot Class 32
, GPRS Multi-slot Class 33
, EDGE (Class unspecified)
, EDGE Multi-slot Class 12
, EDGE Multi-slot Class 32
, EDGE Multi-slot Class 33
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 1.46 Mbps (Cat. 2)
, HSUPA 2.0 Mbps (Cat. 5)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSDPA 1.8 Mbps (Cat. 4)
, HSDPA 3.6 Mbps (Cat. 6)
, HSDPA 7.2 Mbps (Cat. 8)
, HSDPA 10.2 Mbps (Cat. 9)
, HSDPA 14.4 Mbps (Cat. 10)
, HSPA+ 21.1 Mbps (Cat. 18)
, HSPA+ 28.8 Mbps (Cat. 16)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, cdmaOne (IS-95)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, TD-SCDMA
, TD-HSDPA
, LTE (Cat. unspecified)
, LTE 50 Mbps / 25 Mbps (Cat. 2)
, LTE 75 Mbps / 25 Mbps (Cat. 3)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 225 Mbps / 50 Mbps
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 75 Mbps (Cat. 5)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 50 Mbps (LTE Cat. 9)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 50 Mbps (LTE Cat. 11)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12)
, LTE 750 Mbps / 225 Mbps (LTE Cat. 15)
, LTE 1 Gbps / 100 Mbps (LTE Cat. 16)
, LTE 1.2 Gbps / 200 Mbps (LTE Cat. 18)
, LTE 1.4 Gbps / 300 Mbps (LTE Cat. 21)
, LTE 1.6 Gbps (LTE Cat. 19)
, LTE 2 Gbps / 300 Mbps (LTE Cat. 20)
, LTE 2.4 Gbps / 400 Mbps (Cat. 22)
, LTE 2.7 Gbps / 500 Mbps (Cat. 23)
, LTE 3 Gbps / 600 Mbps (LTE Cat. 24) data links |
Communication Interfaces:
|
Supported USB Specification: |
USB 2.0
, USB 3.0 / USB 3.1 Gen 1 / USB 3.2 Gen 1x1![Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then USB 3.2 Gen 1x1 Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then USB 3.2 Gen 1x1](icons/10x10/info_gray.gif) |
Bluetooth support |
Bluetooth 5.2![Released in Dec, 2019 Released in Dec, 2019](icons/10x10/info_gray.gif) |
Wireless LAN support |
IEEE 802.11a
, IEEE 802.11b
, IEEE 802.11g
, IEEE 802.11n
, IEEE 802.11ac
, IEEE 802.11ax (Wi-Fi 6)![Also known as Wi-Fi 6. Supports all ISM bands from 1 to 6 GHz. Subtype of Wi-Fi 6E uses 6 GHz carrier frequency Also known as Wi-Fi 6. Supports all ISM bands from 1 to 6 GHz. Subtype of Wi-Fi 6E uses 6 GHz carrier frequency](icons/10x10/info_gray.gif) |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
B1c
, B1I
, B2a
, B2b BeiDou receiver |
Additional Information:
|
Special Features: single TaiShan V120 (up to 2.62 GHz) + triple TaiShan V120 (up to 2.15 GHz) + quad ARM Cortex-A510 (up to 1.53 GHz) Harvard Superscalar processor cores, ARM big.LITTLE, HMP, HiSilicon Balong 5000 baseband modem, dual SIM 4G support (DSDA, DSDS), Da Vinci NPU, 4K 60 fps video encode, 4K 60 fps video decode, HDR10 support, OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.1, DirectX 12 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2024-04-25 10:24 |