Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 7+ Gen 3 5G SM7675 |
Year Released: |
2024 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv9.2-A |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
1x ARM Cortex-X4 + 4x Cortex-A720 + 3x 1x Cortex-A520 MPcore |
Buses:
|
Memory Interface(s): |
LPDDR5X SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
4200 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
2 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
33.6 Gbyte/s |
Non-volatile Memory Interface |
UFS 4.0![UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2800 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
4 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 732 GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, GPRS Class 12
, GPRS Multi-slot Class 12
, GPRS Multi-slot Class 32
, GPRS Multi-slot Class 33
, EDGE (Class unspecified)
, EDGE Multi-slot Class 10
, EDGE Multi-slot Class 12
, EDGE Multi-slot Class 32
, EDGE Multi-slot Class 33
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 1.46 Mbps (Cat. 2)
, HSUPA 2.0 Mbps (Cat. 5)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSDPA 1.8 Mbps (Cat. 4)
, HSDPA 3.6 Mbps (Cat. 6)
, HSDPA 7.2 Mbps (Cat. 8)
, HSDPA 10.2 Mbps (Cat. 9)
, HSDPA 14.4 Mbps (Cat. 10)
, HSPA+ 21.1 Mbps (Cat. 18)
, HSPA+ 28.8 Mbps (Cat. 16)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, cdmaOne (IS-95)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, CDMA2000 1xEV-DO Revision B
, TD-SCDMA
, TD-HSDPA
, LTE (Cat. unspecified)
, LTE 50 Mbps / 25 Mbps (Cat. 2)
, LTE 75 Mbps / 25 Mbps (Cat. 3)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 225 Mbps / 50 Mbps
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 75 Mbps (Cat. 5)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 50 Mbps (LTE Cat. 9)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 50 Mbps (LTE Cat. 11)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12)
, LTE 750 Mbps / 225 Mbps (LTE Cat. 15)
, LTE 1 Gbps / 100 Mbps (LTE Cat. 16)
, LTE 1.2 Gbps / 200 Mbps (LTE Cat. 18)
, LTE 1.4 Gbps / 300 Mbps (LTE Cat. 21)
, LTE 1.6 Gbps (LTE Cat. 19)
, LTE 2 Gbps / 300 Mbps (LTE Cat. 20)
, LTE 2.4 Gbps / 400 Mbps (Cat. 22)
, NR 1.5 Gbps
, NR 2.6 Gbps
, NR 3.7 Gbps
, NR 4.6 Gbps data links |
Communication Interfaces:
|
Supported USB Specification: |
USB 2.0
, USB 3.0 / USB 3.1 Gen 1 / USB 3.2 Gen 1x1
, USB 3.1 Gen 2 / USB 3.2 Gen 2x1![Released in July, 2013, USB 3.1 Gen 2 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0. Later renamed as USB 3.2 Gen 2x1 Released in July, 2013, USB 3.1 Gen 2 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0. Later renamed as USB 3.2 Gen 2x1](icons/10x10/info_gray.gif) |
Bluetooth support |
Bluetooth 5.4![Two of the major improvements are Periodic Advertising with Responses (PAwR) and Encrypted Advertising Data. Released in Febr, 2023. Two of the major improvements are Periodic Advertising with Responses (PAwR) and Encrypted Advertising Data. Released in Febr, 2023.](icons/10x10/info_gray.gif) |
Wireless LAN support |
IEEE 802.11a
, IEEE 802.11b
, IEEE 802.11g
, IEEE 802.11n
, IEEE 802.11ac
, IEEE 802.11ax (Wi-Fi 6)
, IEEE 802.11be (Wi-Fi 7)![Also known as WiFi 7. Supported carrier frequencies: 2.4 GHz, 5 GHz, 6 GHz Also known as WiFi 7. Supported carrier frequencies: 2.4 GHz, 5 GHz, 6 GHz](icons/10x10/info_gray.gif) |
NFC support |
Yes |
Supported Audio/Video Interface: |
HDMI 1.4
, HDMI 1.4a
, HDMI 1.4b
, HDMI 2.0 (UHD)![HDMI 2.0 specification was published on September 4, 2013 with increased clock speed up to 600 MHz and resolution up to 4096x2160 at 60fps. HDMI 2.0 specification was published on September 4, 2013 with increased clock speed up to 600 MHz and resolution up to 4096x2160 at 60fps.](icons/10x10/info_gray.gif) |
Satellite Navigation:
|
Supported GPS protocol(s): |
GPS (NMEA 0183)![NMEA 0183 NMEA 0183](icons/10x10/info_gray.gif) |
Supported Galileo service(s) |
E1
, E5a![Galileo E5a band centered at 1176.45MHz, uses QPSK(10) modulation Galileo E5a band centered at 1176.45MHz, uses QPSK(10) modulation](icons/10x10/info_gray.gif) |
Supported GLONASS protocol(s) |
L1OF![GLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation. GLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.](icons/10x10/info_gray.gif) |
Supported BeiDou system (BDS) |
B1c
, B1I
, B2a BeiDou receiver |
Additional Information:
|
Special Features: single ARM Cortex-X4 (up to 2800 MHz) + quad ARM Cortex-A720 (up to 2600 MHz) + triple ARM Cortex-A520 (up to 1900 MHz) Harvard Superscalar cores, tri-cluster, HMP, big.LITTLE, Hexagon DSP, Qualcomm X63 5G NR Modem, LTE dual SIM / dual active standby / dual VoLTE support (DSDV), QHD+ 144 Hz / 4K 60 Hz display support, 4K HDR10+ 60 fps video decode, 4K HDR10+ 60 fps video encode, OpenCL 2.0, OpenGL ES 3.2, DirectX 12.1, Vulkan 1.3, 12-bit triple Qualcomm Spectra ISP, 200 MP camera support, 64 MP + 36 MP dual lens camera support, Qualcomm Quick Charge 5 |
Datasheet Attributes:
|
Related Page: |
URL |
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2024-05-04 11:56 |