Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
MediaTek |
Type: |
Helio A20 MT6761D |
Year Released: |
2019 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8 (A32, A64) |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A53 MPcore |
Number of processor core(s): |
quad-core |
Buses:
|
Memory Interface(s): |
LPDDR3 SDRAM
, LPDDR4x SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
1200 MHz |
Non-volatile Memory Interface |
eMMC 5.1![Complies with embedded MMC 5.1 specification released in 2015 Complies with embedded MMC 5.1 specification released in 2015](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1800 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
12 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
IMG PowerVR GE8300 GPU |
GPU Clock: |
550 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, UMTS
, HSUPA
, HSUPA 5.8
, HSUPA 11.5
, HSDPA
, HSPA+ 21.1
, DC-HSDPA 42.2
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, TD-SCDMA
, LTE
, LTE 100/50
, LTE 150/50
, LTE 300/100 data links |
Additional Information:
|
Special Features: quad ARM Cortex-A53 Harvard Superscalar processor core, 800 MHz single-channel LPDDR3 (up to 4 Gbyte) / 1200 MHz LPDDR4x (up to 4 Gbyte) memory interface, eMMC 5.1, integrated GSM / GPRS / UMTS / DC-HSPA 42 Mbps / HSUPA 11.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2020-01-11 18:13 |