Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
MediaTek |
Type: |
Helio A20 MT6761D |
Year Released: |
2019 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8 (A32, A64) |
Number of processor core(s): |
4 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A53 MPcore |
Buses:
|
Memory Interface(s): |
mobile (LP) DDR3 SDRAM
, LPDDR4x SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
1200 MHz |
Non-volatile Memory Interface |
eMMC 5.1![Complies with embedded MMC 5.1 specification released in 2015 Complies with embedded MMC 5.1 specification released in 2015](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1800 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
12 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
IMG PowerVR GE8300 GPU |
GPU Clock: |
550 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSPA+ 21.1 Mbps (Cat. 18)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, TD-SCDMA
, LTE (Cat. unspecified)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 300 Mbps / 100 Mbps (Cat. 7) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
Yes |
Additional Information:
|
Special Features: quad ARM Cortex-A53 Harvard Superscalar processor core, 800 MHz single-channel LPDDR3 (up to 4 Gbyte) / 1200 MHz LPDDR4x (up to 4 Gbyte) memory interface, eMMC 5.1, integrated GSM / GPRS / UMTS / DC-HSPA 42 Mbps / HSUPA 11 Mbps / TD-SCDMA 2.8 Mbps / CDMA2000 1xRTT EV-DO Rev. A / LTE cat. 6 / Cat, 4 baseband modem, dual-SIM support, 1600x720 display support, 1080p video encode, 2160p video decode, 13 MP + 5 MP dual lens / 16 MP camera support, Bluetooth 5.0, FM radio support, ARM Jazelle, ARM TrustZone. MiraVision 2.0, For smartphone devices. |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2020-01-11 18:13 |