Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 730 SM7150-AA |
Year Released: |
2019 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
8x Qualcomm Kyro 470 |
Buses:
|
Memory Interface(s): |
LPDDR4x SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
1866 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
2 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
14.93 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1![UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2200 MHz max. |
Cache Memories:
|
Total L3 Cache: |
1024 Kbyte L3 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
8 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Samsung |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 618 GPU |
GPU Clock: |
610 MHz GPU |
Dedicated Graphics Memory![Dedicated operative memory (video RAM, VRAM) Dedicated operative memory (video RAM, VRAM)](icons/10x10/info_gray.gif) |
0.5 MiB |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, EDGE (Class unspecified)
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSPA+ 21.1 Mbps (Cat. 18)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, CDMA2000 1xEV-DO Revision B
, TD-SCDMA
, LTE (Cat. unspecified)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12)
, LTE 750 Mbps / 225 Mbps (LTE Cat. 15) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
Yes |
Additional Information:
|
Special Features: 2x Qualcomm Kryo 470 (up to 2.2 GHz) + 6x Qualcomm Kryo 470 (up to 1.8 GHz) Harvard Superscalar cores, HMP, Hexagon 688 DSP, Qualcomm Hexagon Vector eXtensions (HVX), Qualcomm X15 LTE Modem, CDMA 2000 1x Adv./DO Rel 0., Rev. A/B, SVDO-DB, GSM, GPRS, EDGE, UMTS, DC-HSPA+ 42 Mbps, DC-HSUPA, SVLTE-DB, Rel9 DC-HSPA+, TD-SCDMA baseband modem, LTE Cat. 15 / Cat 13., LTE dual SIM / dual active standby support (DSDA), 2520x1080 display support, 2160p 60 fps video decode, 720p 240 fps HEVC video encode, Bluetooth 5.0, Qualcomm Spectra 250 ISP, 32 MP single / 20 MP dual camera support, OpenCL 2.0 FP, Vulkan 1.1, OpenGL ES 3.2, DX12, Qualcomm Quick Charge 4.0+, USB 3.1 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2019-04-10 23:34 |