Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 630 SDM630 |
Year Released: |
2017 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8 (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
8x ARM Cortex-A53 MPcore |
Buses:
|
Memory Interface(s): |
LPDDR4x SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
1333 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
2 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
10.66 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1![Complies with embedded MMC 5.1 specification released in 2015 Complies with embedded MMC 5.1 specification released in 2015](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2210 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
14 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 508 GPU |
Dedicated Graphics Memory![Dedicated operative memory (video RAM, VRAM) Dedicated operative memory (video RAM, VRAM)](icons/10x10/info_gray.gif) |
0.125 MiB |
Frame Buffer![Capacity of the volatile memory (usually a VRAM partition) which stores frames to be displayed Capacity of the volatile memory (usually a VRAM partition) which stores frames to be displayed](icons/10x10/info_gray.gif) |
8 KiB |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, EDGE (Class unspecified)
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, CDMA2000 1xEV-DO Revision B
, TD-SCDMA
, LTE (Cat. unspecified)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 50 Mbps (LTE Cat. 9)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 50 Mbps (LTE Cat. 11)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
Yes |
Additional Information:
|
Special Features: octa 64-bit ARM Cortex-A53 MPcore Harvard Superscalar core (max. 2.2 GHz quad-core cluster + quad-core cluster), HMP, eMMC 5.1 interface, SD 3.0 (SDCC), Hexagon 642 DSP, Integrated X12 LTE Global Mode modem, CDMA 2000 1x Adv./EV-DO Rel 0., Rev. A/B, GSM, GPRS, EDGE, UMTS, DB-DC-HSDPA, DC-HSUPA, LTE FDD/TDD Cat. 12 / Cat. 13 (up to 600 / 150 Mbps), SVLTE-DB, Rel9 DC-HSPA+, TD-SCDMA baseband modem, dual SIM / dual standby support, 1920x1200 60 fps display support, 2160p video encode/decode, NFC, Bluetooth 5.0, OpenGL ES 3.1+, OpenCL 2.0 Full, DirectX 12, dual ISP, 24 MP camera support, USB 3.1, Fluence HD noise cancellation technology, Qualcomm Quick Charge 4.0 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2017-07-21 22:38 |