Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
HiSilicon |
Type: |
Honor KIRIN950 |
Year Released: |
2015 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A72 MPcore + 4x ARM Cortex-A53 MPcore |
Buses:
|
Memory Interface(s): |
mobile (LP) DDR3 SDRAM
, mobile (LP) DDR4 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
1333 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
2 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
21.33 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.0![UFS revision 2.0 (released in 2013) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface UFS revision 2.0 (released in 2013) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2300 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
48 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte D-Cache |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
16 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-T880 GPU |
Number of GPU cores: |
4-core GPU |
GPU Clock: |
900 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, GPRS Multi-slot Class 33
, EDGE (Class unspecified)
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 5.76 Mbps (Cat. 6)
, HSDPA (Cat. unspecified)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, TD-SCDMA
, TD-HSDPA
, LTE (Cat. unspecified)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 300 Mbps / 50 Mbps (Cat. 6) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
B1I BeiDou receiver |
Additional Information:
|
Special Features: quad ARM Cortex-A72 (up to 2.3 GHz) + quad ARM Cortex-A53 (up to 1.81 GHz) Harvard Superscalar processor cores, ARM big.LITTLE, HMP, SD 4.1, UFS 2.0, GSM / GPRS Class 33 / EDGE / W-CDMA / HSPA+ 42.2 Mbps / HSUPA 5.76 / TD-SCDMA / LTE-TDD / LTE-FDD Cat. 6 baseband modem, Tensilica HiFi 4 DSP, dual SIM support (DSDA, DSDS), dual 42 MP 14-bit ISP, 2160p30 video encode, 2160p60 video decode, USB 3.0, Bluetooth 4.2, OpenGL ES 3.1, OpenCL 1.2, Vulkan 1.0, DirectX 11.2 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2015-04-09 10:32 |