Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Intel |
Type: |
Atom 2nd Gen Z2480 |
Year Released: |
2012 |
Function |
Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
IA-32 (x86), MMX, SSE, SSE2, SSE3 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
Intel Atom |
Number of processor core(s): |
single-core |
Buses:
|
Memory Interface(s): |
LPDDR2 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
2 ch |
Non-volatile Memory Interface |
Yes |
Clock Frequencies:
|
Recommended Minimum Clock Frequency: |
600 MHz min. |
Recommended Maximum Clock Frequency: |
2000 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
24 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
512 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
32 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Intel |
Pins![Number of pins on the package Number of pins on the package](icons/10x10/info_gray.gif) |
617 pins |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
IMG PowerVR SGX540 GPU |
Number of GPU cores: |
1-core GPU |
GPU Clock: |
400 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Additional Information:
|
Special Features: Intel Atom Saltwell processor core, Intel Smart Cache, Intel Hyper-Threading technology, Intel Smart Idle technology (SIT), Intel Graphics Media accelerator (GMA) GPU, Open VG 1.1, OpenGL ES 1.1, OpenGL ES 2.0 support, 1080p 30fps video encode, 1080p 30fps video decode,.. ›› |
Datasheet Attributes:
|
Data Integrity |
Final |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2012-10-19 18:54 |