Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
HiSilicon |
Type: |
Honor KIRIN710 |
Year Released: |
2018 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A73 + 4x ARM Cortex-A53 MPcore |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR4 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
2 ch |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1![UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Minimum Clock Frequency: |
480 MHz min. |
Recommended Maximum Clock Frequency: |
2189 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
12 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G51 GPU |
Number of GPU cores: |
4-core GPU |
GPU Clock: |
1000 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, GPRS MSC33
, EDGE
, HSUPA
, HSUPA 5.8
, HSDPA
, HSPA+ 42.2
, DC-HSDPA 42.2
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 100/50
, LTE 150/50
, LTE 300/50
, LTE 300/75
, LTE 300/100
, LTE 400/150
, LTE 450/50
, LTE 450/100
, LTE 600/50
, LTE 600/100 data links |
Additional Information:
|
Special Features: quad ARM Cortex-A73 (up to 2189 MHz) + quad ARM Cortex-A53 (up to 1709 MHz) Harvard Superscalar processor cores, ARM big.LITTLE, HMP, GSM / GPRS Class 33 / EDGE / CDMA / W-CDMA / HSPA+ 42.2 Mbps / HSUPA 5.76.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2018-07-21 20:37 |