Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
UNISOC |
Type: |
Tanggula T770 5G / Tiger T7520 |
Year Released: |
2020 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8.3 (A32, A64) |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A76 + 4x ARM Cortex-A55 MPcore |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR4 SDRAM
, LPDDR4x SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
2133 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
2 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
17.06 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 3.1![UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2500 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
6 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G57 GPU |
Number of GPU cores: |
4-core GPU |
GPU Clock: |
780 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, GPRS C10
, GPRS MSC10
, GPRS MSC12
, EDGE
, EDGE MSC10
, UMTS
, HSUPA
, HSUPA 1.4
, HSUPA 2.0
, HSUPA 5.8
, HSUPA 11.5
, HSDPA
, HSDPA 1.8
, HSDPA 3.6
, HSDPA 7.2
, HSDPA 10.2
, HSDPA 14.4
, HSPA+ 21.1
, HSPA+ 28.8
, HSPA+ 42.2
, DC-HSDPA 42.2
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 100/50
, LTE 150/50
, LTE 300/50
, LTE 300/75
, LTE 300/100
, LTE 400/150
, LTE 450/50
, LTE 450/100
, LTE 600/50
, LTE 600/100
, LTE 750/225
, LTE 1200/200
, NR 1500
, NR 2600 data links |
Additional Information:
|
Special Features: 1x ARM Cortex-A76 (up to 2.5 GHz) + 3x ARM Cortex-A76 (up to 2.2 GHz) + 4x ARM Cortex-A55 (up to 2 GHz) Harvard Superscalar processor cores, HMP, GSM/TD-SCDMA/CDMA/WCDMA/LTE-FDD/LTE-TDD/dual-mode NR cellular modem, dual-SIM / dual standby support, 120 Hz 2160x1080.. ›› |
Datasheet Attributes:
|
Data Integrity |
Final |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2020-03-11 16:37 |