Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
UNISOC |
Type: |
Tiger T606 UMS9230 |
Year Released: |
2021 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8.2-A |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
2x ARM Cortex-A75 + 6x ARM Cortex-A55 MPcore |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR3 SDRAM
, LPDDR4 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
2 ch |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.2![Released in Aug, 2020, UFS 2.2 defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface. Introduces a feature called WriteBooster Released in Aug, 2020, UFS 2.2 defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface. Introduces a feature called WriteBooster](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1610 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
12 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G57 GPU |
Number of GPU cores: |
2-core GPU |
GPU Clock: |
650 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, GPRS C10
, EDGE
, EDGE MSC10
, UMTS
, HSUPA
, HSUPA 1.4
, HSUPA 2.0
, HSUPA 5.8
, HSUPA 11.5
, HSDPA
, HSDPA 1.8
, HSDPA 3.6
, HSDPA 7.2
, HSDPA 10.2
, HSDPA 14.4
, HSPA+ 21.1
, HSPA+ 28.8
, HSPA+ 42.2
, DC-HSDPA 42.2
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 100/50
, LTE 150/50
, LTE 300/50
, LTE 600/50 data links |
Additional Information:
|
Special Features: 2x ARM Cortex-A75 (up to 1.61 GHz) + 6x ARM Cortex-A55 (up to 1.61 GHz) Harvard Superscalar processor core, HMP, dual-SIM / dual standby support, 1080p 60 fps video encode/decode, tri-core ISP |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2021-09-23 08:33 |