Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 855+ SM8150-AC |
Codename: |
Hana |
Year Released: |
2019 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
8x Qualcomm Kryo 485 |
Buses:
|
Memory Interface(s): |
LPDDR4x SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
2133 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
4 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
34.13 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1
, UFS 3.0![UFS 3.0 (released in 2017) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface UFS 3.0 (released in 2017) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2956 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
64 Kbyte I-Cache |
Number of L1 Cache Ways: |
4-way |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
64 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
1792 Kbyte L2 |
Number of L2 Cache Ways: |
8-way |
Total L3 Cache: |
2048 Kbyte L3 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
7 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Number of Transistors Integrated: |
6700000000 |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 640 GPU |
GPU Clock: |
672 MHz GPU |
Dedicated Graphics Memory![Dedicated operative memory (video RAM, VRAM) Dedicated operative memory (video RAM, VRAM)](icons/10x10/info_gray.gif) |
1 MiB |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, GPRS Class 12
, GPRS Multi-slot Class 12
, GPRS Multi-slot Class 33
, EDGE (Class unspecified)
, EDGE Multi-slot Class 10
, EDGE Multi-slot Class 12
, EDGE Multi-slot Class 32
, EDGE Multi-slot Class 33
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 1.46 Mbps (Cat. 2)
, HSUPA 2.0 Mbps (Cat. 5)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSDPA 1.8 Mbps (Cat. 4)
, HSDPA 3.6 Mbps (Cat. 6)
, HSDPA 7.2 Mbps (Cat. 8)
, HSDPA 10.2 Mbps (Cat. 9)
, HSDPA 14.4 Mbps (Cat. 10)
, HSPA+ 21.1 Mbps (Cat. 18)
, HSPA+ 28.8 Mbps (Cat. 16)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, cdmaOne (IS-95)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, CDMA2000 1xEV-DO Revision B
, TD-SCDMA
, TD-HSDPA
, LTE (Cat. unspecified)
, LTE 50 Mbps / 25 Mbps (Cat. 2)
, LTE 75 Mbps / 25 Mbps (Cat. 3)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 225 Mbps / 50 Mbps
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 75 Mbps (Cat. 5)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 50 Mbps (LTE Cat. 9)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12)
, LTE 1 Gbps / 100 Mbps (LTE Cat. 16)
, LTE 2 Gbps / 300 Mbps (LTE Cat. 20) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
Yes |
Additional Information:
|
Special Features: SDM855+, quad Qualcomm Kryo 485 Gold Harvard Superscalar cores (1x ARM Cortex-A76 up to 2960 MHz, 3x ARM Cortex-A76 up to 2419 MHz, 1 Mbyte L2 cluster cache) + quad Qualcomm Kryo 485 Silver (4x ARM Cortex-A55 up to 1786 MHz, 512 Kbyte L2 cluster cache) Harvard Superscalar cores, HMP, big.LITTLE, up to 12 GiB RAM, Hexagon 690 DSP, Qualcomm X24 LTE Modem, CDMA 2000 1x Adv./DO Rel 0, Rev. A/B, SVDO-DB, GSM, GPRS, EDGE, UMTS, DB-DC-HSPA+ 84 Mbps, DC-HSUPA, LTE FDD/TDD, SVLTE-DB, Rel9 DC-HSPA+, TD-SCDMA baseband modem, LTE Cat. 20 / Cat 13, dual SIM / dual active standby / dual VoLTE support (DSDV), 2160p 60 fps video decode, 2160p 30 fps video encode, 720p 480 fps video encode, single 4K UHD+ / dual FHD+ 60 Hz display support with HDR10+, Bluetooth 5.0, OpenCL 2.0, OpenGL ES 3.2, DirectX 12, Vulkan 1.1, Qualcomm VIVE 802.11ac/802.11ad, Renderscript Compute, FlexRender support, Qualcomm Spectra 14-bit dual Qualcomm Spectra 380 Image Signal Processors, 48 MP camera support, 24 MP + 24 MP dual lens camera support, EIS 3.0, HDMI 2.0, Qualcomm Quick Charge 4.0/4.0+ |
Datasheet Attributes:
|
Data Integrity |
Final |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2019-07-16 15:28 |