Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 835 MSM8998 |
Year Released: |
2017 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
8x Qualcomm Kryo 280 |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR4 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
1866 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
2 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
29.86 Gbyte/s |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1![UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2450 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
2048 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
10 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Number of Transistors Integrated: |
3100000000 |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Samsung |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 540 GPU |
GPU Clock: |
710 MHz GPU |
Dedicated Graphics Memory![Dedicated operative memory (video RAM, VRAM) Dedicated operative memory (video RAM, VRAM)](icons/10x10/info_gray.gif) |
1 MiB |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, GPRS C10
, GPRS C12
, GPRS MSC10
, GPRS MSC12
, GPRS MSC33
, EDGE
, EDGE MSC10
, EDGE MSC12
, EDGE MSC33
, UMTS
, HSUPA
, HSUPA 1.4
, HSUPA 2.0
, HSUPA 5.8
, HSUPA 11.5
, HSDPA
, HSDPA 1.8
, HSDPA 3.6
, HSDPA 7.2
, HSDPA 10.2
, HSDPA 14.4
, HSPA+ 21.1
, HSPA+ 28.8
, HSPA+ 42.2
, DC-HSDPA 42.2
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, CDMA2000 1xEV-DO Rev B
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 50/25
, LTE 75/25
, LTE 100/50
, LTE 150/50
, LTE 225/50
, LTE 300/50
, LTE 300/75
, LTE 400/150
, LTE 450/50
, LTE 450/100
, LTE 600/50
, LTE 600/100
, LTE 1000/100
, LTE 1200/200 data links |
Additional Information:
|
Special Features: quad Qualcomm Kryo 280 Harvard Superscalar cores (up to 2.45 GHz, 2 Mbyte cluster L2 cache) + quad Qualcomm Kryo Harvard Superscalar cores (up to 1.9 GHz, 1 Mbyte cluster L2 cache), HMP, big.LITTLE, Hexagon 680 DSP, Qualcomm X16 LTE.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2016-12-14 22:47 |