Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 8s Gen 3 SM8635 |
Year Released: |
2024 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv9.2-A |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
1x ARM Cortex-X4 + 4x Cortex-A720 + 3x 1x Cortex-A520 MPcore |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR5X SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
4200 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
4 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
67.2 Gbyte/s |
Non-volatile Memory Interface |
UFS 4.0![UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
3010 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
4 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 735 GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, GPRS C12
, GPRS MSC12
, GPRS MSC32
, GPRS MSC33
, EDGE
, EDGE MSC10
, EDGE MSC12
, EDGE MSC32
, EDGE MSC33
, UMTS
, HSUPA
, HSUPA 1.4
, HSUPA 2.0
, HSUPA 5.8
, HSUPA 11.5
, HSDPA
, HSDPA 1.8
, HSDPA 3.6
, HSDPA 7.2
, HSDPA 10.2
, HSDPA 14.4
, HSPA+ 21.1
, HSPA+ 28.8
, HSPA+ 42.2
, DC-HSDPA 42.2
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, CDMA2000 1xEV-DO Rev B
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 50/25
, LTE 75/25
, LTE 100/50
, LTE 150/50
, LTE 225/50
, LTE 300/50
, LTE 300/75
, LTE 300/100
, LTE 400/150
, LTE 450/50
, LTE 450/100
, LTE 600/100
, LTE 1000/100
, LTE 1200/200
, LTE 1600
, LTE 2400/400
, LTE 3000/600
, NR 1500
, NR 2600
, NR 3700
, NR 4600 data links |
Additional Information:
|
Special Features: single ARM Cortex-X4 (up to 3010 MHz) + quad ARM Cortex-A720 (up to 2610 MHz) + triple ARM Cortex-A520 (up to 1840 MHz) Harvard Superscalar cores, triple-cluster HMP, big.LITTLE, Hexagon DSP, Qualcomm X70 5G NR Modem, CDMA 2000.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2024-03-24 20:38 |