Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
MediaTek |
Type: |
MT8752 |
Year Released: |
2014 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8 (A32, A64) |
Number of processor core(s): |
4 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A53 MPcore |
Buses:
|
Memory Interface(s): |
mobile (LP) DDR3 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
800 MHz |
Number of data bus channels: |
1 ch |
Non-volatile Memory Interface |
NAND Flash Interface |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1700 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
512 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
28 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-T760 GPU |
Number of GPU cores: |
2-core GPU |
GPU Clock: |
700 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 11.5 Mbps (Cat. 7)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, TD-SCDMA
, LTE (Cat. unspecified)
, LTE 150 Mbps / 50 Mbps (Cat. 4) data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
Yes |
Additional Information:
|
Special Features: quad ARM Cortex-A53 Harvard Superscalar processor core, 533 MHz LP-DDR3 / 800 MHz LP-DDR3 SD RAM interface, integrated GSM / GPRS / UMTS / DC-HSPA 42 Mbps / HSUPA 11 Mbps / TD-SCDMA 2.8 Mbps / LTE cat. 4 baseband modem, dual-SIM support, 1920x1200 (WUXGA) display support, 1080p video encode, 1080p video decode, embedded GPS / GLONASS / BeiDou module, Bluetooth 4.0, FM radio support, ARM Jazelle, ARM TrustZone, 16 MP camera support. For tablet devices. |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2014-10-14 00:17 |