Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 400 APQ8026 |
Year Released: |
2014 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
ARMv7 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A7 MPcore |
Number of processor core(s): |
quad-core |
Buses:
|
Memory Interface(s): |
LPDDR2 SDRAM
, LPDDR3 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
533 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
1 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
4.26 Gbyte/s |
Non-volatile Memory Interface |
eMMC 4.5![Complies with embedded MMC 4.5 specification released in 2011 Complies with embedded MMC 4.5 specification released in 2011](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1200 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
16 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
16 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
1024 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
28 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 304 GPU |
GPU Clock: |
450 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Additional Information:
|
Special Features: Quad ARM Cortex-A7 MPcore Harvard Superscalar core, Hexagon QDSP6V4, 13 MP camera support, 1080p video encode/decode, gpsOneGen 8A with GLONASS, Bluetooth 4.0, OpenGL ES 3.0, OpenCL 1.1, OpenVG 1.1, EGL 3.1, DirectX 11 |
Datasheet Attributes:
|
Data Integrity |
Incomplete |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2014-06-26 19:28 |