Generel Characteristics: |
|
Designer | HiSilicon |
Type: | K3V2E |
Year Released: | 2013 |
Function | Multi-core Application Processor |
Architecture: |
|
Width of Machine Word | 32 bit |
Supported Instruction Set(s): | ARMv7 |
Pipeline Stages | 8 pipeline stages |
Type of processor core(s) | 4x ARM Cortex-A9 MPcore |
Number of processor core(s): | quad-core |
Buses: |
|
Memory Interface(s): | LPDDR2 SDRAM |
Max. Clock Frequency of Memory IF | 450 MHz |
Data Bus Width | 32 bit |
Number of data bus channels: | 2 ch |
Max. Data Rate | 7.2 Gbyte/s |
Non-volatile Memory Interface | NAND Flash Interface |
Clock Frequencies: |
|
Recommended Maximum Clock Frequency: | 1600 MHz max. |
Cache Memories: |
|
L1 Instruction Cache per Core | 32 Kbyte I-Cache |
L1 Data Cache per Core | 32 Kbyte D-Cache |
Total L2 Cache | 1024 Kbyte L2 |
Technology and Packaging: |
|
Feature Size | 28 nm |
Semiconductor Technology: | CMOS |
Graphical Subsystem: |
|
Embedded GPU | Vivante GC4000 GPU |
Number of GPU cores: | 16-core GPU |
GPU Clock: | 480 MHz GPU |
Cellular Communication: |
|
Supported Cellular Data Links | No |
Additional Information: |
|
Special Features: quad ARM Cortex-A9 Superscalar processor cores,1080p30 video encode, 1080p60 video decode, camera support |
|
Datasheet Attributes: |
|
Data Integrity | Preliminary |
Added | 2014-03-19 12:00 |
Tweet | |