Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
MediaTek |
Type: |
MT8312 |
Year Released: |
2013 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
ARMv7 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
2x ARM Cortex-A7 MPcore |
Number of processor core(s): |
dual-core |
Buses:
|
Memory Interface(s): |
Yes |
Number of data bus channels: |
1 ch |
Non-volatile Memory Interface |
Yes |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1300 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
256 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
28 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
N/A |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, UMTS
, HSUPA
, HSUPA 5.8
, HSDPA
, TD-SCDMA data links |
Additional Information:
|
Special Features: dual ARM Cortex-A7 Harvard Superscalar processor core, integrated GSM / GPRS / UMTS Rel. 8 / HSDPA 21.1 Mbps / HSUPA 5.76 Mbps / TD-SCDMA 2.8Mbps baseband modem, dual-SIM support, 720p video encode, 720p video decode, Image signal processor,.. ›› |
Datasheet Attributes:
|
Data Integrity |
Incomplete |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2013-12-03 13:18 |