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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Oppo
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated Pad 2 11.6 Premium Edition WiFi 256GB OPD2201
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet
The back panel is exquisuitely polished, comfortable to the touch, and resistant to fingerprints
ReleasedFirst official market release date in (year, month) 2023 Mar
AnnouncedDate of the official announcement (year, month) 2023 Mar 22
Hardware DesignerThe company which designed this device Oppo
ManufacturerThe company which produces this device BBK Electronics
CodenameThe codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename BBK Aries
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series X22N2
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen , Active stylusStylus in default package
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields
Dolby Atmos sound, Dolby Vision HDR, OPPO Pencil active stylus

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 258.03 mm
10.16 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 189.41 mm
7.46 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 6.54 mm
0.26 inchesDepth measured in inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 319.6 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 552 g
19.47 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 13 (Tiramisu)Google Android 13 (Tiramisu)
ColorOS 13.1Subversion, update version, user interface, defualt language, etc.
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Voice Command , Navigation softwarepre-installed , Augmented Reality (AR) , Intelligent personal assistantLearning personal assistant based on artificial intelligence (AI) , Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 3050 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors MediaTek Dimensity 9000 MT6983, 2022, 64 bit, octa-core, 8192 Kbyte L3, 4 nm, ARM Mali-G710 GPUMediaTek Dimensity 9000 MT6983, 2022, 64 bit, octa-core, 8192 Kbyte L3, 4 nm, ARM Mali-G710 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR5 SDRAM
3200 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 12288 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 244140 MiB non-volatile

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 294.89 mm
11.6 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 2800x2000
5600000 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 239.96 mm
9.45 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 171.4 mm
6.75 inchDisplay height in inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 18.07 mm
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 41129.8 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 84.2%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.0857 mm/pixel
Pixel DensityIndicates the number of pixels per inch 296 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Display Color DepthColor depth defines how many colors or greyscales can be displayed 30 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 1073.7M
Display Dynamic Range DepthBit depth of the dynamic range defines the luminance ratio between the brightest and the darkest state of a pixel (HDR10: 10 bit, HDR10+: 12 bit) 11 bit/pixel
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  LEDLight-emitting Diodes
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  Yes
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  Yes
Display Refresh RateFrame refresh frequency of the main display 144 Hz
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Yes

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-G710MP10
GPU Clock:  848 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono

Sound Playing: 
Loudspeaker(s):   44.0 Surround sound or four microphones for noise cancellation
Audio Output:   USB Type-C

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  10-point
Touchscreen Sampling rateMaximal sampling frequency of the touch-sensitive screen module. Maximal sampling rate is usually not available at maximal number of touch points 144 Hz
KeyboardConventional input peripheral which allows the user to enter characters by pressing a dedicated key  Attachable QWERTY
Keyboard BacklightPhones and some palmtops, netbooks, notebooks, rugged computers have keyboard backlighting to help the user with typing in dim ambient conditions  Aut. keyboard backlight (upon press of key/low light)Automatic keyboard backlight (upon press of any key) with ambient light intensity sensor


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  No
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB fast chargingFast charging is supported , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB On-The-Go 1.3 , USB On-The-Go 2.0 , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V. , USB Power Delivery 2.0Device which meets USB Power Delivery 2.0 is able to supply current from 3 A to 5 A for the client device at 20V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Type-C reversible
Max. Charging PowerMultiplication of maximal charging current and maximal battery voltage during battery recharging 67.0 W
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.3Released in July, 2021
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DPAdvanced Audio Distribution Profile , A2DP with aptX codecAdvanced Audio Distribution Profile with aptX codec , A2DP with aptX HD codecAdvanced Audio Distribution Profile with aptX High Definition codec , AVRCPAudio/Video Remote Control Profile (AVRCP) , DIPDevice ID Profile (DIP) , GAPGeneric Access Profile (GAP) , GAVDPGeneric Audio/Video Distribution Profile (GAVDP) , HFPHands-Free Profile (HFP) , HIDHuman Interface Device Profile (HID) , HSPHeadset Profile (HSP) , MAPMessage Access Profile (MAP) , OPPObject Push Profile (OPP) , PANPersonal Area Networking Profile (PAN) , PBAPhone Book Access Profile (PBA)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11aShort range standard, 5 GHz, max. 54 Mbit/s , IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , IEEE 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , IEEE 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas , IEEE 802.11ax (Wi-Fi 6)Also known as Wi-Fi 6. Supports all ISM bands from 1 to 6 GHz. Subtype of Wi-Fi 6E uses 6 GHz carrier frequency
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  Wi-Fi Direct , Wi-Fi TetheringWi-Fi Mobile Hotsport , WiDiIntel Wireless Display , Wi-Fi Calling (VoWiFi)Voice over WiFi (VoWiFi)

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
Satellite Antenna:   Internal antenna
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS (S-GPS) , Geotagging , QuickGPS , QZSSQuasi-Zenith Satellite System
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Supported Galileo service(s)Galileo is a global satellite navigation system operated by European Union and the European Space Agency.  E1Galileo E1 band centered at 1575.42 MHz and with a reference bandwidth of 24.552 MHz, uses the Composite Binary Offset Carrier (CBOC) modulation
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1cBeiDou-3 B1C signals, transmitted by Medium Earth Orbit (MEO) satellites and the Inclined GeoSynchronous Orbit (IGSO) satellites of BDS-3, are centered at 1575.42 MHz and feature a BOC(1,1) modulation , B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset MediaTek MT6983

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 4160x3120 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 13.0 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.20
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  Phase-Detection Autofocus (PD AF)Phase-detection (PD) is a passive autofocus system which measures the phase difference between a two images to reach correct focus.
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 3840x2160 pixel
30 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  dual LED
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  Electronic Image Stabilizer (EIS)EIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , Video Stabilizer (EIS) , HDR photoHigh dynamic range image recording , Red-eye effect reduction , Burst mode , Touch focus , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Secondary Image Sensor FormatThe format of the sec. camera image sensor determines the physical dimensions of the sensor 1/4.00
Secondary Image Sensor Pixel SizePixel size of the secondary camera image sensor 1.12 micrometer
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 3264x2448 pixel
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/2.28
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Recordable Video FormatsSupported file formats while capturing videos by the secondary camera  3GP
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  Electronic Image Stabilizer (EIS)EIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , Video Stabilizer (EIS) , HDR photoHigh dynamic range image recording , Burst mode , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D (3-axis) accelerometer
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D (3-axis) gyro
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Hall sensor , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , Step counter

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion polymer (LiPo)
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Voltage (1st cell)Idle voltage of the charged battery cell 3.89 Volts
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 9510 mAh cell
Nominal Battery VoltageIf there are more than 1 cells in the battery in series connection the nominal resulting battery voltage is the sum of voltage of cells 3.89 Volts
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 9510 mAh battery
Nominal Battery EnergyThe product of battery capacity and nominal voltage determines the maximal nominal stored energy in the battery 36.99 Wh

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  China
Market RegionsRegions where the device was officially sold. Overlap is possible.  Asia
PriceGross end user price recommended by the manufacturer on the day of product release 3399
Chinese YuanCurrency of the given gross end user price

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2023-09-26 20:34
 

Oppo Pad 2 11.6 Premium Edition WiFi 256GB OPD2201 (BBK Aries) Detailed Tech Specs

Oppo Pad 2 11.6 Premium Edition WiFi 256GB OPD2201 (BBK Aries) Detailed Tech Specs
Platform: android Keyboard USB Services: usb_otg USB Connector: usb_c Bluetooth Wireless LAN Supported GPS protocol(s) Supported GLONASS protocol(s) Supported BeiDou system (BDS) Number of effective pixels: 13.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 8.0 MP sec. cam Built-in accelerometer Built-in gyroscope Additional sensors: stepcounter

Predecessor Model

Oppo Pad Air 10.4 WiFi 128GB X21N3
Oppo Pad Air 10.4 WiFi 128GB X21N3
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See also

Oppo Pad 2 11.6 Premium Edition WiFi 512GB OPD2201 (BBK Aries)
Oppo Pad 2 11.6 Premium Edition WiFi 512GB OPD2201 (BBK Aries)
X22N2, 258.03x189.41x6.54 mm, Google Android 13 (Tiramisu), MediaTek Dimensity 9000 MT6983, 12 GiB RAM, 512 GB ROM, 11.6 inch, 2800x2000, 13.0 MP camera, 8.0 MP sec. cam, 9510 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Pad 2 11.6 Standard Edition WiFi 256GB OPD2201 (BBK Aries)
Oppo Pad 2 11.6 Standard Edition WiFi 256GB OPD2201 (BBK Aries)
X22N2, 258.03x189.41x6.54 mm, Google Android 13 (Tiramisu), MediaTek Dimensity 9000 MT6983, 8 GiB RAM, 256 GB ROM, 11.6 inch, 2800x2000, 13.0 MP camera, 8.0 MP sec. cam, 9510 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

OnePlus Pad 11.6 WiFi 256GB OPD2203 (BBK Aries)
OnePlus Pad 11.6 WiFi 256GB OPD2203 (BBK Aries)
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OnePlus Pad 11.6 WiFi 128GB OPD2203 (BBK Aries)
OnePlus Pad 11.6 WiFi 128GB OPD2203 (BBK Aries)
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4 weeks ago
Oppo Reno12 F 5G 2024 Premium Edition Global Dual SIM TD-LTE V1 512GB CPH2637 (BBK 2637)
75.8x163.1x7.76 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 6300 MT6835T, 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 32.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 F 5G 2024 Premium Edition Global Dual SIM TD-LTE V1 256GB CPH2637 (BBK 2637)
4 weeks ago
Oppo Reno12 F 5G 2024 Premium Edition Global Dual SIM TD-LTE V1 256GB CPH2637 (BBK 2637)
75.8x163.1x7.76 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 6300 MT6835T, 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 32.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 F 5G 2024 Premium Edition Global TD-LTE V1 256GB CPH2637 (BBK 2637)
4 weeks ago
Oppo Reno12 F 5G 2024 Premium Edition Global TD-LTE V1 256GB CPH2637 (BBK 2637)
75.8x163.1x7.76 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 6300 MT6835T, 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 32.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 F 5G 2024 Standard Edition Global Dual SIM TD-LTE V1 256GB CPH2637 (BBK 2637)
4 weeks ago
Oppo Reno12 F 5G 2024 Standard Edition Global Dual SIM TD-LTE V1 256GB CPH2637 (BBK 2637)
75.8x163.1x7.76 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 6300 MT6835T, 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 32.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 Pro 5G 2024 Premium Edition Dual SIM TD-LTE V2 ID 512GB CPH2629 (BBK 2629)
4 weeks ago
Oppo Reno12 Pro 5G 2024 Premium Edition Dual SIM TD-LTE V2 ID 512GB CPH2629 (BBK 2629)
74.8x161.5x7.45 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 7300 MT6878, 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2412, 50.3 MP camera, 50.3 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 Pro 5G 2024 Premium Edition Global Dual SIM TD-LTE V1 512GB CPH2629 (BBK 2629)
4 weeks ago
Oppo Reno12 Pro 5G 2024 Premium Edition Global Dual SIM TD-LTE V1 512GB CPH2629 (BBK 2629)
74.8x161.5x7.45 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 7300 MT6878, 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2412, 50.3 MP camera, 50.3 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 Pro 5G 2024 Premium Edition Dual SIM TD-LTE CN 512GB PJW110 (BBK 2629A)
4 weeks ago
Oppo Reno12 Pro 5G 2024 Premium Edition Dual SIM TD-LTE CN 512GB PJW110 (BBK 2629A)
74.8x161.4x7.6 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 9200+ MT6985Z, 16 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2412, 50.3 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 Pro 5G 2024 Premium Edition Dual SIM TD-LTE CN 256GB PJW110 (BBK 2629A)
4 weeks ago
Oppo Reno12 Pro 5G 2024 Premium Edition Dual SIM TD-LTE CN 256GB PJW110 (BBK 2629A)
74.8x161.4x7.6 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 9200+ MT6985Z, 16 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2412, 50.3 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 Pro 5G 2024 Standard Edition Dual SIM TD-LTE CN 256GB PJW110 (BBK 2629A)
4 weeks ago
Oppo Reno12 Pro 5G 2024 Standard Edition Dual SIM TD-LTE CN 256GB PJW110 (BBK 2629A)
74.8x161.4x7.6 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 9200+ MT6985Z, 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2412, 50.3 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno12 5G 2024 Standard Edition Global TD-LTE V1 512GB CPH2625 (BBK 2625)
Oppo Reno12 5G 2024 Standard Edition Global TD-LTE V1 512GB CPH2625 (BBK 2625)
74.1x161.4x7.6 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 7300 MT6878, 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2412, 50.3 MP camera, 32.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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