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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Oppo
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated Pad 2 11.6 Standard Edition WiFi 256GB OPD2201
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet
With 4096 levels of pressure sensitivity, it accurately senses the pressure and delivers a realistic drawing experience
ReleasedFirst official market release date in (year, month) 2023 Mar
AnnouncedDate of the official announcement (year, month) 2023 Mar 22
Hardware DesignerThe company which designed this device Oppo
ManufacturerThe company which produces this device BBK Electronics
CodenameThe codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename BBK Aries
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series X22N2
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen , Active stylusStylus in default package
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 258.03 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 189.41 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 6.54 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 10.16x7.46x0.26 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 552 g
19.47 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 13 (Tiramisu)Google Android 13 (Tiramisu)
ColorOS 13.1Subversion, update version, user interface, defualt language, etc.
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Voice Command , Navigation softwarepre-installed , Augmented Reality (AR) , Intelligent personal assistantLearning personal assistant based on artificial intelligence (AI) , Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 3050 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors MediaTek Dimensity 9000 MT6983, 2022, 64 bit, octa-core, 8192 Kbyte L3, 4 nm, ARM Mali-G710 GPUMediaTek Dimensity 9000 MT6983, 2022, 64 bit, octa-core, 8192 Kbyte L3, 4 nm, ARM Mali-G710 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR5 SDRAM
3200 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 8 GiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 256 GB ROM

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 294.89 mm
11.6 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 2800x2000
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 18.07 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 84.2%
Pixel DensityIndicates the number of pixels per inch 296 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Number of Display ScalesMaximal number of displayable colors or scales 1073.7M
Display Refresh RateFrame refresh frequency of the main display 144 Hz
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Yes

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-G710MP10
GPU Clock:  848 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono
Loudspeaker(s):   44.0 Surround sound or four microphones for noise cancellation
Audio Output:   USB Type-C

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch screen
KeyboardConventional input peripheral which allows the user to enter characters by pressing a dedicated key  Attachable QWERTY

Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  No
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB HS (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB fast chargingFast charging is supported , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB OTG 1.3 , USB OTG 2.0 , USB PDDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V. , USB PD 2.0Device which meets USB Power Delivery 2.0 is able to supply current from 3 A to 5 A for the client device at 20V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB C reversible
Max. Charging PowerMultiplication of maximal charging current and maximal battery voltage during battery recharging 67.0 W
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.3Released in July, 2021
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  802.11aShort range standard, 5 GHz, max. 54 Mbit/s , 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas , 802.11axAlso known as Wi-Fi 6. Supports all ISM bands from 1 to 6 GHz. Subtype of Wi-Fi 6E uses 6 GHz carrier frequency
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  Wi-Fi Direct , Wi-Fi TetheringWi-Fi Mobile Hotsport , WiDiIntel Wireless Display , Wi-Fi CallingVoice over WiFi (VoWiFi)

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No


Satellite NavigationSatellite Navigation: 
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS , Geotagging , QuickGPS , QZSSQuasi-Zenith Satellite System
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Supported Galileo service(s)Galileo is a global satellite navigation system operated by European Union and the European Space Agency.  E1Galileo E1 band centered at 1575.42 MHz and with a reference bandwidth of 24.552 MHz, uses the Composite Binary Offset Carrier (CBOC) modulation
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1cBeiDou-3 B1C signals, transmitted by Medium Earth Orbit (MEO) satellites and the Inclined GeoSynchronous Orbit (IGSO) satellites of BDS-3, are centered at 1575.42 MHz and feature a BOC(1,1) modulation , B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 13.0 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.20
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  PD AFPhase-detection (PD) is a passive autofocus system which measures the phase difference between a two images to reach correct focus.
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 3840x2160 pixel
30 fpsRecording frame rate when recording video at maximum resolution
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  dual LED
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  EISEIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , EIS (video) , HDR photoHigh dynamic range image recording , Red-eye reduction , Burst mode , Touch focus , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/2.28
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  EISEIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , EIS (video) , HDR photoHigh dynamic range image recording , Burst mode , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D accelerometer
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D gyro
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Hall , L sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , Step counter

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Li-ion polymer (LiPo)
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Battery VoltageIf there are more than 1 cells in the battery in series connection the nominal resulting battery voltage is the sum of voltage of cells 3.89 Volts
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 9510 mAh battery
Nominal Battery EnergyThe product of battery capacity and nominal voltage determines the maximal nominal stored energy in the battery 36.99 Wh

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  Australia , Belgium , China , Cyprus , Czech , Denmark , Estonia , France , Germany , Greece , Indonesia , Italy , Latvia , Lithuania , Netherlands , NZNew Zealand (NZ) , Poland , Romania , Serbia , Singapore , Slovakia , Slovenia , Spain
Market RegionsRegions where the device was officially sold. Overlap is possible.  Asia , Australia , Eastern Europe , Europe , Southeast Asia , Western Europe
PriceGross end user price recommended by the manufacturer on the day of product release 699
AUDCurrency of the given gross end user price

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2023-09-26 20:22
 

Oppo Pad 2 11.6 Standard Edition WiFi 256GB OPD2201 (BBK Aries)

Oppo Pad 2 11.6 Standard Edition WiFi 256GB OPD2201 (BBK Aries)
Platform: android Keyboard USB Services: usb_otg USB Connector: usb_c Bluetooth Wireless LAN Complementary Satellite Services Supported GLONASS protocol(s) Supported BeiDou system (BDS) Number of effective pixels: 13.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 8.0 MP sec. cam Built-in accelerometer Built-in gyroscope Additional sensors: stepcounter
Available at overseas Electronics - www.welectronics.com

Predecessor Model

Oppo Pad Air 10.4 WiFi 64GB X21N3
Oppo Pad Air 10.4 WiFi 64GB X21N3
OPD2102A, 245.08x154.84x6.94 mm, Google Android 12 (S), Qualcomm Snapdragon 680 SM6225, 4 GiB RAM, 64 GB ROM, 10.4 inch, 2000x1200, 8.0 MP camera, 4.9 MP sec. cam, 7100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

See also

Oppo Pad 2 11.6 Premium Edition WiFi 512GB OPD2201 (BBK Aries)
Oppo Pad 2 11.6 Premium Edition WiFi 512GB OPD2201 (BBK Aries)
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Oppo Pad 2 11.6 Premium Edition WiFi 256GB OPD2201 (BBK Aries)
Oppo Pad 2 11.6 Premium Edition WiFi 256GB OPD2201 (BBK Aries)
X22N2, 258.03x189.41x6.54 mm, Google Android 13 (Tiramisu), MediaTek Dimensity 9000 MT6983, 12 GiB RAM, 256 GB ROM, 11.6 inch, 2800x2000, 13.0 MP camera, 8.0 MP sec. cam, 9510 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

OnePlus Pad 11.6 WiFi 256GB OPD2203 (BBK Aries)
OnePlus Pad 11.6 WiFi 256GB OPD2203 (BBK Aries)
258.03x189.41x6.54 mm, Google Android 13 (Tiramisu), MediaTek Dimensity 9000 MT6983, 12 GiB RAM, 256 GB ROM, 11.6 inch, 2800x2000, 13.0 MP camera, 8.0 MP sec. cam, 9510 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

OnePlus Pad 11.6 WiFi 128GB OPD2203 (BBK Aries)
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258.03x189.41x6.54 mm, Google Android 13 (Tiramisu), MediaTek Dimensity 9000 MT6983, 8 GiB RAM, 128 GB ROM, 11.6 inch, 2800x2000, 13.0 MP camera, 8.0 MP sec. cam, 9510 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Oppo Reno11 A 5G 2024 Dual SIM TD-LTE JP V4 256GB CPH2603 (BBK 2603)
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Oppo Find X7 5G Premium Edition Dual SIM TD-LTE CN 1TB PHZ110 (BBK NVWA)
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Oppo Find X7 5G Premium Edition Dual SIM TD-LTE CN 512GB PHZ110 (BBK NVWA)
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Oppo Find X7 5G Premium Edition Dual SIM TD-LTE CN 256GB PHZ110 (BBK NVWA)
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Oppo Find X7 5G Standard Edition Dual SIM TD-LTE CN 256GB PHZ110 (BBK NVWA)
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Oppo Find X7 Ultra 5G Standard Edition Dual SIM TD-LTE CN 256GB PHY110 (BBK Pangu)
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Oppo Find X7 Ultra 5G Premium Edition Dual SIM TD-LTE CN 512GB PHY110 (BBK Pangu)
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Oppo Find X7 Ultra 5G Satellite Edition Dual SIM TD-LTE CN 512GB PHY120 (BBK Pangu)
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Oppo Find X7 Ultra 5G Premium Edition Dual SIM TD-LTE CN 256GB PHY110 (BBK Pangu)
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