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IntroductionIntroduction: 

BrandBrand name of the device. This may match with the manufacturer Oppo
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated Pad Air 10.4 WiFi 128GB X21N3
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet
Equipped with power-efficient Snapdragon 8-core 6nm processor, the OPPO Pad Air can carry out more advanced tasks while conserving power
ReleasedFirst official market release date in (year, month) 2022 Jun
AnnouncedDate of the official announcement (year, month) 2022 May
Hardware DesignerThe company which designed this device Oppo
ManufacturerThe company which produces this device BBK Electronics
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.

Physical AttributesPhysical Attributes: 

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 245.08 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 154.84 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 6.94 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 9.65x6.1x0.27 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 440 g
15.52 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 

PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 12 (S)Google Android 12 (S)
ColorOS 12.1Subversion, update version, user interface, defualt language, etc.
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Voice Command , Navigation softwarepre-installed , Augmented Reality (AR) , Intelligent personal assistantLearning personal assistant based on artificial intelligence (AI) , Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset: 

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2400 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 680 SM6225, 2021, 64 bit, octa-core, 6 nm, Qualcomm Adreno 610 GPUQualcomm Snapdragon 680 SM6225, 2021, 64 bit, octa-core, 6 nm, Qualcomm Adreno 610 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR4x SDRAM
2133 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 4 GiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  UFS 2.2Released in Aug, 2020, UFS 2.2 defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface. Introduces a feature called WriteBooster
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 128 GB ROM

DisplayDisplayAll parameters that related to display

Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 263.1 mm
10.4 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 2000x1200
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 19.47 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 80.5%
Pixel DensityIndicates the number of pixels per inch 225 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Number of Display ScalesMaximal number of displayable colors or scales 1073.7M
Display Refresh RateFrame refresh frequency of the main display 60 Hz
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Yes

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 610
GPU Clock 1115 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 

Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono
Loudspeaker(s):   44.0 Surround sound or four microphones for noise cancellation
Audio Output:   USB Type-C

Cellular PhoneCellular Phone: 

Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch screen

Communication InterfacesCommunication Interfaces: 

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB  , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSDXCA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB HS (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB fast chargingFast charging is supported , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB OTG 1.3 , USB OTG 2.0 , USB PDDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V. , USB PD 2.0Device which meets USB Power Delivery 2.0 is able to supply current from 3 A to 5 A for the client device at 20V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB C reversible
Max. Charging PowerMultiplication of maximal charging current and maximal battery voltage during battery recharging 18.0 W
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.1Released in Jan, 2019
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  802.11aShort range standard, 5 GHz, max. 54 Mbit/s , 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  Wi-Fi Direct , Wi-Fi TetheringWi-Fi Mobile Hotsport , WiDiIntel Wireless Display , Wi-Fi CallingVoice over WiFi (VoWiFi)

Multimedia BroadcastMultimedia Broadcast: 

FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No


Satellite NavigationSatellite Navigation: 

Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS , Geotagging , QuickGPS , QZSSQuasi-Zenith Satellite System
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Supported Galileo service(s)Galileo is a global satellite  navigation system operated by European Union and the European Space Agency.  E1Galileo E1 band centered at 1575.42  MHz and with a reference bandwidth of 24.552 MHz, uses the Composite Binary Offset Carrier (CBOC) modulation
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any

Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Image Sensor Pixel SizePixel size of the primary camera sensor 1.12 micrometer
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.00
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  CD AFContrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1080x720 pixel
30 fpsRecording frame rate when recording video at maximum resolution
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  dual LED
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  EISEIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , EIS (video) , HDR photoHigh dynamic range image recording , Red-eye reduction , Burst mode , Touch focus , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No
Aux. Camera Aperture (W)Wide-angle aperture of aux. lens or aperture of aux. lens in case of aux. camera without optical zoom f/2.40
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies

Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 4.9 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/2.20
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1080x720 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  HDR photoHigh dynamic range image recording , Burst mode , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 

Built-in accelerometerAn internal component that senses acceleration components of the device.  Used for automatic screen rotation and for games and applications that rely on acceleration measurement  on X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D accelerometer
Built-in gyroscopeAn internal component that senses the orientation of the device.  Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D gyro
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Hall , L sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , Step counter

Ingress ProtectionIngress Protection: 

Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 

BatteryBattery technology  Li-ion polymer (LiPo)
built-inPossible options: removable, built-in
Battery Cells in ParallelIf this field is true the cells of the battery are in parallel connection while discharging. If false the cells of the battery are in serial. Some devices applies serial connection while fast charging and paralel connection while discharging Yes
2-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Battery VoltageIf there are more than 1 cells in the battery in series connection the nominal resulting battery voltage is the sum of voltage of cells 3.87 Volts
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 7100 mAh battery
Nominal Battery EnergyThe product of battery capacity and nominal voltage determines the maximal nominal stored energy in the battery 27.48 Wh

Geographical AttributesGeographical Attributes: 

Market CountriesCountries where the device was officially sold. Overlap is possible.  Belgium , Cyprus , France , Germany , Greece , India , Indonesia , Italy , Malaysia , Netherlands , Singapore , Spain , Taiwan
Market RegionsRegions where the device was officially sold.  Overlap is possible.  Asia , Europe , Southeast Asia , Western Europe
PriceGross end user price recommended by the manufacturer on the day of product release 1299
MYRCurrency of the given gross end user price

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2023-04-24 21:46
 
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