 Generel Characteristics:
|
Designer |
Samsung |
| Type: |
Exynos 9 Dual 9110 |
| Codename: |
SC59110XSC |
| Year Released: |
2018 |
| Function |
Multi-core Application Processor with Modem |
 Architecture:
|
| Width of Machine Word |
64 bit |
| Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
| Type of processor core(s) |
2x ARM Cortex-A53 MPcore |
| Number of processor core(s): |
dual-core |
 Buses:
|
| Memory Interface(s): |
LPDDR4 SDRAM
, LPDDR4x SDRAM |
| Data Bus Width |
32 bit |
| Number of data bus channels: |
1 ch |
| Non-volatile Memory Interface |
eMMC 5.1
, moviNAND
, NAND Flash Interface |
 Clock Frequencies:
|
| Recommended Maximum Clock Frequency: |
1150 MHz max. |
 Cache Memories:
|
 Technology and Packaging:
|
| Feature Size |
10 nm |
| Semiconductor Technology: |
FinFET |
| Fab |
Samsung |
 Graphical Subsystem:
|
| Embedded GPU |
ARM Mali-T720 GPU |
| Number of GPU cores: |
1-core GPU |
| GPU Clock: |
667 MHz GPU |
 Cellular Communication:
|
| Supported Cellular Data Links |
CSD
, GPRS
, EDGE
, UMTS
, HSUPA
, HSUPA 5.8
, HSDPA
, HSPA+ 21.1
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 100/50
, LTE 150/50 data links |
 Additional Information:
|
Special Features:
Dual ARM Cortex-A53 Harvard Superscalar processor cores processor cores, ARM TrustZone, ARM NEON SIMD engine, 5 MP camera support, 720p video decode, qHD (854x480, 480x480) display support. SiP-ePoP (System-in-Package - embedded Package on Package). For wearable devices, OpenCL 1.1, Open.. ›› |
 Datasheet Attributes:
|
| Data Integrity |
Preliminary |
| Added |
2018-08-10 18:18 |
All details | 
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