Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Allwinner |
Type: |
A33 |
Year Released: |
2014 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
ARMv7 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A7 MPcore |
Number of processor core(s): |
quad-core |
Buses:
|
Memory Interface(s): |
DDR3L SDRAM
, LPDDR3 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
1 ch |
Non-volatile Memory Interface |
NAND Flash Interface |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
N/A |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
512 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
40 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
N/A |
Number of GPU cores: |
2-core GPU |
GPU Clock: |
600 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Additional Information:
|
Special Features: quad ARM Cortex-A7 Harvard Superscalar processor core, 32 + 32 Kbyte L1 cache per core, ARM Jazelle, ARM TrustZone, OpenGL ES 2.0, 1280x800 display support, 2160p video decode, 1080p 30fps video encode, HDMI 1.4 1080p 60fps, 8 MP ISP,.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2014-11-29 10:19 |