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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Intel
Type Pentium N3520
Codename Bay Trail
Year Released 2013
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE 4.1, SSE 4.2
Number of processor core(s) 4
Type of processor core(s)Type and allocation of processor core(s) 4x Intel Bay Trail-M

BusesBuses: 
Memory Interface(s):   DDR3L (LV) SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 667 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 10.67 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Internal Systembus Clock 500 MHz
Recommended Minimum Clock Frequency 2166 MHz min.
Recommended Maximum Clock Frequency 2420 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 24 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 2048 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 22 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Intel
PinsNumber of pins on the package 1170 pins

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel HD Graphics GPU
GPU Clock 313 MHz GPU

Cellular CommunicationCellular Communication: 

Supported Cellular Data LinksList of supported cellular data links  No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features 2166 MHz Quad Intel Bay Trail-M processor cores, 8-way 32 Kbyte instruction cache per core, 6-way 24 Kbyte data cache per core, 16-way 2 Mbyte L2 Cache, dual-channel 64-bit 667 MHz DDR3L-1333 SD RAM interface (max. 21.3GB/sec), Intel Hyper-Threading Technology, 313 MHz Intel HD Graphics GPU (max. 854 MHz), Image Signal Processor, Intel Smart Connect Technology

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2014-02-19 22:39
 
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