Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Intel |
Type: |
Celeron N2840 |
Codename: |
Bay Trail |
Year Released: |
2014 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE4.1, SSE 4.2 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
2x Intel Bay Trail-M |
Number of processor core(s): |
dual-core |
Buses:
|
Memory Interface(s): |
DDR3L SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
667 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
64 bit |
Number of data bus channels: |
1 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
5.34 Gbyte/s |
Non-volatile Memory Interface |
Yes |
Clock Frequencies:
|
Recommended Minimum Clock Frequency: |
2160 MHz min. |
Recommended Maximum Clock Frequency: |
2580 MHz max. |
Cache Memories:
|
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
1024 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
22 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Intel |
Pins![Number of pins on the package Number of pins on the package](icons/10x10/info_gray.gif) |
1170 pins |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Intel HD Graphics GPU |
GPU Clock: |
311 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Additional Information:
|
Special Features: 2.58 GHz (Burst Frequency) dual Intel Bay Trail-M processor cores, 1024 Kbyte L2 Cache per core, 64-bit 667 MHz MHz DDR3L-1333 SD RAM interface, Intel Hyper-Threading Technology, 311 MHz Intel HD Graphics GPU (max. 792 MHz), Intel Smart Connect Technology,.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2015-09-15 23:41 |