Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Texas Instruments |
Type: |
Sitara AM3703 |
Year Released: |
2010 |
Function |
Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
ARMv7 |
Pipeline Stages![Pipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. Pipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions.](icons/10x10/info_gray.gif) |
13 pipeline stages |
Number of processor core(s): |
1 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
ARM Cortex-A8 |
Buses:
|
Memory Interface(s): |
mobile (LP) DDR SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
1 ch |
Non-volatile Memory Data Bus Width![Maximum selectable bit width of secondary data (non-volatile storage) bus of memory interface Maximum selectable bit width of secondary data (non-volatile storage) bus of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Non-volatile Memory Interface |
Yes |
DMA Channels![DMA (Direct Memory Access) allows direct data transfer between operative memory (RAM) and peripherals (hard disk, non-volatile storage, etc.) bypassing processor core. Multiple DMA channels allows parallel DMA operations. DMA (Direct Memory Access) allows direct data transfer between operative memory (RAM) and peripherals (hard disk, non-volatile storage, etc.) bypassing processor core. Multiple DMA channels allows parallel DMA operations.](icons/10x10/info_gray.gif) |
32 ch |
Clock Frequencies:
|
Recommended Minimum Clock Frequency: |
800 MHz min. |
Recommended Maximum Clock Frequency: |
300 MHz max. |
Cache Memories:
|
L1 Instruction Cache per Core![Capacity of level 1 instruction cache per processor core Capacity of level 1 instruction cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte I-Cache |
L1 Data Cache per Core![Capacity of level 1 data cache per processor core Capacity of level 1 data cache per processor core](icons/10x10/info_gray.gif) |
32 Kbyte D-Cache |
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
256 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
45 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Texas Instruments |
Pins![Number of pins on the package Number of pins on the package](icons/10x10/info_gray.gif) |
515 pins |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
N/A |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
No |
Additional Information:
|
Special Features: NEON SIMD Coprocessor, 32-Ch System DMA controller, 16/32-bit LPDDR memory interface, 32Kbyte On-Chip ROM, 64Kbyte On-Chip SRAM, ARM TrustZone, Composite and S-video TV output, embedded image signal processor, SmartReflex Technology, DVFS, High Speed USB 2.0 On-The-Go support |
Datasheet Attributes:
|
Related Page: |
URL |
Data Integrity |
Final |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2013-11-17 19:33 |