Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Texas Instruments |
Type: |
OMAP 4460 |
Year Released: |
2011 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
ARMv7 |
Pipeline Stages![Pipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. Pipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions.](icons/10x10/info_gray.gif) |
8 pipeline stages |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
2x ARM Cortex-A9 MPcore + 2x ARM Cortex-M3 |
Number of processor core(s): |
dual-core |
Buses:
|
Memory Interface(s): |
LPDDR2 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
2 ch |
Non-volatile Memory Interface |
NAND Flash Interface |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1500 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
45 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Texas Instruments |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
IMG PowerVR SGX540 GPU |
Number of GPU cores: |
1-core GPU |
GPU Clock: |
307 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Additional Information:
|
Special Features: dual ARM Cortex-A9 Harvard Superscalar processor core, embedded image signal processor (20MP camera support, 12MP stereo 3D camera support), 2D/3D graphics acceleration (IVA 3), OpenGL ES v2.0, OpenGL ES v1.1, OpenVG v1.1, EGL v1.3, SmartReflex 2 technologies, M-shield mobile security,.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2011-06-12 14:10 |