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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Texas Instruments
Type OMAP 3503
Year Released 2009
FunctionMain function of the component  Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 13 pipeline stages
Type of processor core(s)Type and allocation of processor core(s) ARM Cortex-A8
Number of processor core(s) single-core

BusesBuses: 
Memory Interface(s):   LPDDR SDRAM
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 1 ch
Non-volatile Memory Data Bus WidthMaximum selectable bit width of secondary data (non-volatile storage) bus of memory interface 16 bit
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  NAND Flash Interface , NOR Flash Interface , OneNANDOneNAND is a NAND flash memory interface developed by Samsung


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 600 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 256 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 65 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Texas Instruments
PinsNumber of pins on the package 515 pins

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). N/A

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Additional InformationAdditional Information: 
Special Features
NEON SIMD Coprocessor, 64-Ch EDMA, 32-Ch sDMA controller, OneNAND, asynchs SRAM support, Embedded image signal processor, 112Kbyte ROM, 64Kbyte SRAM, ARM TrustZone, Composite and S-video TV output, SmartReflex Technology, High Speed USB 2.0 On-The-Go support

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2010-07-21 10:01
 
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