Generel Characteristics: |
Designer |
Texas Instruments |
Type: |
OMAP 3503 |
Year Released: |
2009 |
Function |
Application Processor |
Architecture: |
Width of Machine Word |
32 bit |
Supported Instruction Set(s): |
ARMv7 |
Pipeline Stages |
13 pipeline stages |
Type of processor core(s) |
ARM Cortex-A8 |
Number of processor core(s): |
single-core |
Buses: |
Memory Interface(s): |
LPDDR SDRAM |
Data Bus Width |
32 bit |
Number of data bus channels: |
1 ch |
Non-volatile Memory Data Bus Width |
16 bit |
Non-volatile Memory Interface |
NAND Flash Interface
, NOR Flash Interface
, OneNAND |
Clock Frequencies: |
Recommended Maximum Clock Frequency: |
600 MHz max. |
Cache Memories: |
L1 Instruction Cache per Core |
16 Kbyte I-Cache |
L1 Data Cache per Core |
16 Kbyte D-Cache |
Total L2 Cache |
256 Kbyte L2 |
Technology and Packaging: |
Feature Size |
65 nm |
Semiconductor Technology: |
CMOS |
Fab |
Texas Instruments |
Pins |
515 pins |
Graphical Subsystem: |
Embedded GPU |
N/A |
Cellular Communication: |
Supported Cellular Data Links |
No |
Additional Information: |
Special Features: NEON SIMD Coprocessor, 64-Ch EDMA, 32-Ch sDMA controller, OneNAND, asynchs SRAM support, Embedded image signal processor, 112Kbyte ROM, 64Kbyte SRAM, ARM TrustZone, Composite and S-video TV output, SmartReflex Technology, High Speed USB 2.0 On-The-Go support |
Datasheet Attributes: |
Data Integrity |
Final |
Added |
2010-07-21 10:01 |