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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Apple
Type A17 Pro APL1002 / APL1V02
Codename T8130
Year Released 2023
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8.6-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 2x Apple Coll P + 4x Apple Coll E cores
Number of processor core(s) hexa-core

BusesBuses: 
Memory Interface(s):   LPDDR4x SDRAM , LPDDR5 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 3200 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 16 bit
Number of data bus channels 4 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 51.2 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface , SATASATA revision 1.0 (2003) offering 1.5 Gbit/s data rate , SATA IISerial AT Attachment revision 2.0 (released in 2004) or 2.x offering 3 Gbit/s data rate , UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface , UFS 3.1 2-laneComplies with dual-lane Universal Flash Storage 3.1 revision offering 2.9 GB/s NAND flash data rate , UFS 4.0UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 3780 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 192 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 128 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 20480 Kbyte L2
Total L3 Cache 24576 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 3 nm
Semiconductor Technology:   FinFETMultigate (usually double-gate) MOSFET transistor technology
Number of Transistors Integrated 19000000000
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Apple G16P GPU
Number of GPU cores 6-core GPU
GPU Clock 1398 MHz GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Additional InformationAdditional Information: 
Special Features
2x high-performance 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores (up to 3.78 GHz, 192 KB L1 data cache per core, 128 KB L1 instruction cache per core, 8 MiB L2 cache per core) + 4x high-efficiency 64-bit ARMv8-compatible (AArch32-AArch64) Harvard.. ››

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2023-11-22 12:39
 
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