Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Samsung |
Type: |
Exynos 1380 5G S5E8835 |
Year Released: |
2023 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8.3 (A32, A64) |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A78 + 4x ARM Cortex-A55 MPcore |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR4x SDRAM
, LPDDR5 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
4 ch |
Non-volatile Memory Interface |
UFS 3.1![UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2400 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
5 nm |
Semiconductor Technology: |
FinFET![Multigate (usually double-gate) MOSFET transistor technology Multigate (usually double-gate) MOSFET transistor technology](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Samsung |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G68 GPU |
Number of GPU cores: |
5-core GPU |
GPU Clock: |
950 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, GPRS C12
, EDGE
, EDGE MSC12
, EDGE MSC32
, UMTS
, HSUPA
, HSUPA 1.4
, HSUPA 2.0
, HSUPA 5.8
, HSUPA 11.5
, HSDPA
, HSDPA 1.8
, HSDPA 3.6
, HSDPA 7.2
, HSDPA 10.2
, HSDPA 14.4
, HSPA+ 21.1
, HSPA+ 28.8
, DC-HSDPA 42.2
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, CDMA2000 1xEV-DO Rev B
, TD-SCDMA
, LTE
, LTE 50/25
, LTE 75/25
, LTE 100/50
, LTE 150/50
, LTE 225/50
, LTE 300/50
, LTE 300/75
, LTE 300/100
, LTE 400/150
, LTE 450/50
, LTE 450/100
, LTE 600/50
, LTE 600/100
, LTE 750/225
, LTE 1000/100
, LTE 1200/200
, LTE 1600
, NR 1500
, NR 2600
, NR 3700 data links |
Additional Information:
|
Special Features: quad ARM Cortex-A78 (up to 2.4 GHz) + quad ARM Cortex-A78 (up to 2 GHz) Harvard Superscalar processor cores, dual-cluster HMP, ARM big.LITTLE, ARM TrustZone, ARM NEON SIMD engine, 144 Hz FHD+ display support, 200 MP single, 16 + 16.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2023-04-08 22:10 |