Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
JLQ |
Type: |
JR510 |
Year Released: |
2021 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8.2-A |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
8x ARM Cortex-A55 MPcore |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR3 SDRAM
, LPDDR4x SDRAM |
Non-volatile Memory Interface |
eMMC 5.1
, UFS 2.1![UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
2000 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
11 nm |
Semiconductor Technology: |
FinFET![Multigate (usually double-gate) MOSFET transistor technology Multigate (usually double-gate) MOSFET transistor technology](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
ARM Mali-G52 GPU |
Number of GPU cores: |
1-core GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, GPRS C10
, EDGE
, EDGE MSC10
, UMTS
, HSUPA
, HSUPA 1.4
, HSUPA 2.0
, HSUPA 5.8
, HSUPA 11.5
, HSDPA
, HSDPA 1.8
, HSDPA 3.6
, HSDPA 7.2
, HSDPA 10.2
, HSDPA 14.4
, HSPA+ 21.1
, HSPA+ 28.8
, HSPA+ 42.2
, DC-HSDPA 42.2
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 100/50
, LTE 150/50
, LTE 300/50
, LTE 300/75
, LTE 300/100
, LTE 400/150 data links |
Additional Information:
|
Special Features: 4x ARM Cortex-A55 (up to 2 GHz) + 4x ARM Cortex-A55 (up to 1.5 GHz) Harvard Superscalar processor core, HMP, dual-SIM / dual standby support, 1080p 60 fps video encode/decode, 60 Hz 1080p / 90 Hz 720p display support, 50.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2023-02-17 20:55 |