Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 200 MSM8625Q |
Codename: |
Snapdragon S4 Play |
Year Released: |
2013 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
ARMv7-A |
Number of processor core(s): |
4 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A5 MPcore |
Buses:
|
Memory Interface(s): |
mobile (LP) DDR SDRAM
, mobile (LP) DDR2 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
1 ch |
Non-volatile Memory Interface |
eMMC 4.5![Complies with embedded MMC 4.5 specification released in 2011 Complies with embedded MMC 4.5 specification released in 2011](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Minimum Clock Frequency: |
800 MHz min. |
Recommended Maximum Clock Frequency: |
1200 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
45 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 203 GPU |
Dedicated Graphics Memory![Dedicated operative memory (video RAM, VRAM) Dedicated operative memory (video RAM, VRAM)](icons/10x10/info_gray.gif) |
0.25 MiB |
Cellular Communication:
|
Supported Cellular Data Links |
GPRS (Class unspecified)
, EDGE (Class unspecified)
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSDPA (Cat. unspecified)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, CDMA2000 1xEV-DO Revision B data links |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Additional Information:
|
Special Features: 4x ARM Cortex-A5 processor cores, Embedded 384 MHz Hexagon QDSP5 DSP, CDMA2000 1xRTT, 1xEV-DO Rel.0/Rev.A/Rev.B, 1xEV-DO MC Rev. A, GPRS, EDGE, W-CDMA/UMTS, HSDPA, HSUPA, MBMS baseband support, OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1, EGL 1.3, Direct3D Mobile, DirectDraw support, 840x480 FWVGA display support, 720p video decode, 720p video encode, gpsOne Gen 7A GPS module, 8 MP camera support, Bluetooth 4.0 support |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2012-10-03 18:41 |