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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated SM-T710 Galaxy Tab S2 8.0 WiFi 32GB
ReleasedFirst official market release date in (year, month) 2015 Aug
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 134.8 mm
5.31 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 198.6 mm
7.82 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 5.6 mm
0.22 inchesDepth measured in inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 149.9 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 265 g
9.35 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 5.0.2 (Lollipop)Google Android 5.0.2 (Lollipop)

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1900 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Samsung Exynos 5 Octa 5433, 2014, 64 bit, octa-core, 20 nm, ARM Mali-T760 GPUSamsung Exynos 5 Octa 5433, 2014, 64 bit, octa-core, 20 nm, ARM Mali-T760 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  mobile (LP) DDR3 SDRAM
825 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 3072 MiB RAM
2750 MiB user accessible RAMRAM space that unprotected system and user tasks can access

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 30518 MiB non-volatile
25500 MiB free user storageUser-accessible partition of non-volatile storage space

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 203.1 mm
8 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1536x2048
3145728 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 121.86 mm
4.8 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 162.48 mm
6.4 inchDisplay height in inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 12.94 mm
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 19799.8 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 74.0%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.07934 mm/pixel
Pixel DensityIndicates the number of pixels per inch 320 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color AM-OLEDColor AM-OLED (Active Matrix - Organic Light-emitting Diode) display techology. display
Display SubtypeBrand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBlack, etc.  Super AM-OLEDSuper AM-OLED is an improved type of AM-OLED display technology developed by Samsung where touch-sensitve layer is integrated into the screen. Super AM-OLED uses Samsung PenTile matrix RGBG subpixel arrangement (2 subpixels)
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Self-illuminatingOLED-based display technologies do not require illumination because they are built up from organic light-emitting diodes.
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  RGBG PenTile Matrix (2 subpixels)PenTile RGBG is a subpixel rendering sceme developed in 1999. In a PenTile matrix each pixel has 2 subpixels. Green subpixel is shared with neighboring pixels so the pixel density can be higher but image quality is lower than RGB's.
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-T760MP6

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  MHL 2.2
USB Series Micro-B (Micro-USB)Physical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25
A/V Out Max. ResolutionThe largest resolution supported by video out  Yes

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono

Sound Playing: 
Loudspeaker(s):   mono
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Vibrating Alert

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  10-point


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSD Extended CapacityA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB On-The-Go 1.3 , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Series Micro-AB
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 4.1Bluetooth 4.1 is an evolutionary update to the Bluetooth Core Specification. It rolls up adopted Bluetooth Core Specification Addenda (CSA1, 2, 3 & 4) while adding new features and benefits. Bluetooth 4.1 improves usability for consumers, empowers inn
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DP with aptX codecAdvanced Audio Distribution Profile with aptX codec
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11aShort range standard, 5 GHz, max. 54 Mbit/s , IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , IEEE 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , IEEE 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  DLNADLNA (Digital Living Network Alliance) over Wireless LAN , Wi-Fi Direct , Wi-Fi TetheringWi-Fi Mobile Hotsport

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 3264x2448 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/1.90
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  Contrast Detection Autofocus (CD AF)Contrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  3GP , MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  No
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 1920x1080 pixel
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 2.1 MP sec. cam
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Recordable Video FormatsSupported file formats while capturing videos by the secondary camera  3GP

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Fingerprint sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor placed at the front, rear or any side of the device , Hall sensor , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 4000 mAh cell

Geographical AttributesGeographical Attributes: 

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2015-02-20 23:41
 

Samsung SM-T710 Galaxy Tab S2 8.0 WiFi 32GB Detailed Tech Specs

Samsung SM-T710 Galaxy Tab S2 8.0 WiFi 32GB Detailed Tech Specs
Platform: android A/V Out Audio Output: audio_jack Complementary Phone Services: vibration Expansion Interfaces USB Services: usb_otg Bluetooth Wireless LAN Supported BeiDou system (BDS) Number of effective pixels: 8.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 2.1 MP sec. cam Built-in compass Built-in accelerometer Built-in gyroscope Additional sensors: fingerprint

Predecessor Model

Samsung SM-T700 Galaxy Tab S 8.4-inch WiFi 32GB (Samsung Klimt)
Samsung SM-T700 Galaxy Tab S 8.4-inch WiFi 32GB (Samsung Klimt)
klimtwifixx, 125.6x212.8x6.6 mm, Google Android 4.4.2 (KitKat), Samsung Exynos 5 Octa 5420, 2 GiB RAM, 32 GB ROM, 8.4 inch, 1600x2560, 8.0 MP camera, 2.1 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

High Resolution Photos

samsung galaxy tab s2 9 7 14

Software Updates / Related Files

Samsung SM-T710 Galaxy Tab S2 8.0 WiFi Android 6.0.1 System Update XXU2CPD9
Samsung SM-T710 Galaxy Tab S2 8.0 WiFi Android 6.0.1 System Update XXU2CPD9
2016 May 4, Samsung | All detailsAll details

See also

Samsung SM-C5560 Galaxy Y55 5G 2024 Standard Edition TD-LTE CN 128GB (Samsung M556)
Samsung SM-C5560 Galaxy Y55 5G 2024 Standard Edition TD-LTE CN 128GB (Samsung M556)
76.5x163.9x7.8 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 1 5G SM7450-AB, 8 GiB RAM, 128 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 13.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-E556B/DS Galaxy F55 5G 2024 Standard Edition Global TD-LTE 128GB (Samsung M556)
Samsung SM-E556B/DS Galaxy F55 5G 2024 Standard Edition Global TD-LTE 128GB (Samsung M556)
76.5x163.9x7.8 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 1 5G SM7450-AB, 8 GiB RAM, 128 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-S928J Galaxy S24 Ultra 5G UW TD-LTE JP 1TB SCG26 (Samsung Muse 3)
Samsung SM-S928J Galaxy S24 Ultra 5G UW TD-LTE JP 1TB SCG26 (Samsung Muse 3)
S928JPN, 79x162.3x8.6 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 1000 GB ROM, 6.8 inch, 1440x3120, 201.3 MP camera, 12.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-S928J Galaxy S24 Ultra 5G UW TD-LTE JP 512GB SCG26 (Samsung Muse 3)
Samsung SM-S928J Galaxy S24 Ultra 5G UW TD-LTE JP 512GB SCG26 (Samsung Muse 3)
S928JPN, 79x162.3x8.6 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.8 inch, 1440x3120, 201.3 MP camera, 12.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-S921J Galaxy S24 5G UW TD-LTE JP 512GB SCG25 (Samsung Muse 1)
Samsung SM-S921J Galaxy S24 5G UW TD-LTE JP 512GB SCG25 (Samsung Muse 1)
S921JPN, 70.6x147x7.6 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 8 GiB RAM, 512 GB ROM, 6.2 inch, 1080x2340, 50.1 MP camera, 12.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-M556E/DS Galaxy M55 5G 2024 Standard Edition TD-LTE EU 256GB (Samsung M556)
Samsung SM-M556E/DS Galaxy M55 5G 2024 Standard Edition TD-LTE EU 256GB (Samsung M556)
M556ELGCEUB, 76.5x163.9x7.8 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 1 5G SM7450-AB, 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-M556E/DS Galaxy M55 5G 2024 Standard Edition TD-LTE EU 128GB (Samsung M556)
Samsung SM-M556E/DS Galaxy M55 5G 2024 Standard Edition TD-LTE EU 128GB (Samsung M556)
M556EZKAEUB, 76.5x163.9x7.8 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 1 5G SM7450-AB, 8 GiB RAM, 128 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-M556B/DS Galaxy M55 5G 2024 Premium Edition Global TD-LTE 256GB (Samsung M556)
Samsung SM-M556B/DS Galaxy M55 5G 2024 Premium Edition Global TD-LTE 256GB (Samsung M556)
M556BLGYMID, 76.5x163.9x7.8 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 1 5G SM7450-AB, 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-M556B/DS Galaxy M55 5G 2024 Standard Edition Global TD-LTE 256GB (Samsung M556)
Samsung SM-M556B/DS Galaxy M55 5G 2024 Standard Edition Global TD-LTE 256GB (Samsung M556)
M556BLGMZTO, 76.5x163.9x7.8 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 1 5G SM7450-AB, 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-M556B/DS Galaxy M55 5G 2024 Standard Edition Global TD-LTE 128GB (Samsung M556)
Samsung SM-M556B/DS Galaxy M55 5G 2024 Standard Edition Global TD-LTE 128GB (Samsung M556)
M556BZKAINS, 76.5x163.9x7.8 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 1 5G SM7450-AB, 8 GiB RAM, 128 GB ROM, 6.7 inch, 1080x2400, 50.1 MP camera, 50.1 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-G556B Galaxy XCover7 5G 2024 Global TD-LTE 128GB (Samsung G550)
Samsung SM-G556B Galaxy XCover7 5G 2024 Global TD-LTE 128GB (Samsung G550)
G556BZKDEEB, 80.1x169x10.2 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 6100+ MT6835, 6 GiB RAM, 128 GB ROM, 6.6 inch, 1080x2408, 50.1 MP camera, 4.9 MP sec. cam, 4050 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-S928Q Galaxy S24 Ultra 5G UW Dual SIM TD-LTE JP 1TB (Samsung Muse 3)
Samsung SM-S928Q Galaxy S24 Ultra 5G UW Dual SIM TD-LTE JP 1TB (Samsung Muse 3)
S928QZKNSJP, 79x162.3x8.6 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 1000 GB ROM, 6.8 inch, 1440x3120, 201.3 MP camera, 12.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-S928Q Galaxy S24 Ultra 5G UW Dual SIM TD-LTE JP 512GB (Samsung Muse 3)
Samsung SM-S928Q Galaxy S24 Ultra 5G UW Dual SIM TD-LTE JP 512GB (Samsung Muse 3)
S928QZKFSJP, 79x162.3x8.6 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.8 inch, 1440x3120, 201.3 MP camera, 12.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-S928Q Galaxy S24 Ultra 5G UW Dual SIM TD-LTE JP 256GB (Samsung Muse 3)
Samsung SM-S928Q Galaxy S24 Ultra 5G UW Dual SIM TD-LTE JP 256GB (Samsung Muse 3)
S928QZTESJP, 79x162.3x8.6 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.8 inch, 1440x3120, 201.3 MP camera, 12.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-S921Q Galaxy S24 5G Dual SIM TD-LTE JP 512GB (Samsung Muse 1)
Samsung SM-S921Q Galaxy S24 5G Dual SIM TD-LTE JP 512GB (Samsung Muse 1)
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Samsung SM-S921Q Galaxy S24 5G Dual SIM TD-LTE JP 256GB (Samsung Muse 1)
Samsung SM-S921Q Galaxy S24 5G Dual SIM TD-LTE JP 256GB (Samsung Muse 1)
S921QZYESJP, 70.6x147x7.6 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 8 GiB RAM, 256 GB ROM, 6.2 inch, 1080x2340, 50.1 MP camera, 12.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-X308U Galaxy Tab Active5 5G 8.0 2024 Standard Edition TD-LTE US 128GB (Samsung X300)
Samsung SM-X308U Galaxy Tab Active5 5G 8.0 2024 Standard Edition TD-LTE US 128GB (Samsung X300)
126.8x213.8x10.1 mm, Google Android 14 (Upside Down Cake), Samsung Exynos 1380 5G S5E8835, 6 GiB RAM, 128 GB ROM, 8 inch, 1200x1920, 13.0 MP camera, 4.9 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-X306N Galaxy Tab Active5 5G 8.0 2024 Standard Edition TD-LTE KR 128GB (Samsung X300)
Samsung SM-X306N Galaxy Tab Active5 5G 8.0 2024 Standard Edition TD-LTE KR 128GB (Samsung X300)
X306NZGAKOO, 126.8x213.8x10.1 mm, Google Android 14 (Upside Down Cake), Samsung Exynos 1380 5G S5E8835, 6 GiB RAM, 128 GB ROM, 8 inch, 1200x1920, 13.0 MP camera, 4.9 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-X300 Galaxy Tab Active5 8.0 2024 Standard Edition WiFi 128GB (Samsung X300)
Samsung SM-X300 Galaxy Tab Active5 8.0 2024 Standard Edition WiFi 128GB (Samsung X300)
X300NZGAN20, 126.8x213.8x10.1 mm, Google Android 14 (Upside Down Cake), Samsung Exynos 1380 5G S5E8835, 6 GiB RAM, 128 GB ROM, 8 inch, 1200x1920, 13.0 MP camera, 4.9 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-X306B Galaxy Tab Active5 5G 8.0 2024 Premium Edition Global TD-LTE 256GB (Samsung X300)
Samsung SM-X306B Galaxy Tab Active5 5G 8.0 2024 Premium Edition Global TD-LTE 256GB (Samsung X300)
X306BZGESTS, 126.8x213.8x10.1 mm, Google Android 14 (Upside Down Cake), Samsung Exynos 1380 5G S5E8835, 8 GiB RAM, 256 GB ROM, 8 inch, 1200x1920, 13.0 MP camera, 4.9 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

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You are here: Device Specs \ Samsung SM-T710 Galaxy Tab S2 8.0 WiFi 32GB Detailed Tech Specs
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