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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Sony
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated Xperia XZ2 Compact Global TD-LTE H8314 / PF32
ReleasedFirst official market release date in (year, month) 2018 Apr 6
AnnouncedDate of the official announcement (year, month) 2018 Feb 26
Hardware DesignerThe company which designed this device Sony
ManufacturerThe company which produces this device Sony
CodenameThe codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename Sony Apollo
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series PM-1132-BV
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 64.9 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 135 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 12.1 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 2.56x5.31x0.48 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 168 g
5.93 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 8.0 (Oreo)Google Android 8.0 (Oreo)
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Voice Command , Navigation softwarepre-installed , Augmented Reality (AR) , Intelligent personal assistantLearning personal assistant based on artificial intelligence (AI)

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2800 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 845 SDM845 (Napali), 2018, 64 bit, octa-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 1536 Kbyte L2, 2048 Kbyte L3, 10 nm, Qualcomm Adreno 630 GPUQualcomm Snapdragon 845 SDM845 (Napali), 2018, 64 bit, octa-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 1536 Kbyte L2, 2048 Kbyte L3, 10 nm, Qualcomm Adreno 630 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR4 SDRAM
1866 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 4 GiB RAM
3700 MiB user accessible RAMRAM space that unprotected system and user tasks can access

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 64 GB ROM
52000 MiB total user storageThe sum of primary and secondary user-accessible partition of non-volatile storage spaces

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 126.06 mm
5 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1080x2160
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 8.52 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 72.5%
Pixel DensityIndicates the number of pixels per inch 487 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Gorilla Glass 5Introduced in 2016

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 630
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) of graphics controller or GPU which independent from the op. memory of the main processor. Graphics controller may have access to the main RAM (shared RAM) too 1 MiB
GPU Clock:  710 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  stereo
Loudspeaker(s):   stereo
Audio Output:   USB Type-C

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  GSM850GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM900GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM1800GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM1900GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS2100 (B1)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz) , UMTS1900 (B2)UMTS1900 phones support UMTS 1900MHz (PCS, also refferred as UMTS Band II) band (downlink: 1932.4 - 1987.6 MHz, uplink: 1852.4-1907.6 MHz) , UMTS1700/2100 (B4)UMTS1700/2100 phones support UMTS 1700 / 2100 MHz (AWS, also refferred as UMTS Band IV) band (downlink: 2112.4 - 2152.6 MHz, uplink: 1712.4-1752.6 MHz) , UMTS850 (B5)UMTS850 phones support UMTS 850 MHz (CLR, also refferred as UMTS Band V) band (downlink: 871.4 - 891.6 MHz, uplink: 826.4 - 846.6 MHz) , UMTS800 (B6)UMTS800 phones support UMTS 800 MHz (UMTS Band 6) band (downlink: 875 - 885 MHz, uplink: 830-840 MHz) , UMTS900 (B8)UMTS900 phones support UMTS 900 MHz (UMTS Band VIII) band (downlink: 927.4 - 957.6 MHz, uplink: 882.4-912.6 MHz) , UMTS800 (B19)UMTS800 phones support UMTS 800 MHz (UMTS Band 6) band (downlink: 877.4 - 887.6 MHz, uplink: 832.4-842.6 MHz) , LTE2100 (B1)LTE2100 phones support LTE 1900 / 2100MHz (IMT, also refferred as LTE Band 1) band (downlink: 2110 - 2170 MHz, uplink: 1920 - 1980 MHz) , LTE1900 (B2)LTE1900 phones support LTE 1900 MHz (PCS , also referred as LTE Band 2) band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz) , LTE1800 (B3)LTE1800 phones support LTE 1800 MHz (LTE Band 3) band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz) , LTE1700/2100 (B4)LTE1700/2100 phones support LTE 1700 / 2100 MHz (AWS also referred as LTE Band 4) band (downlink: 2110 - 2155 MHz, uplink: 1710 - 1755 MHz) , LTE850 (B5)LTE850 phones support LTE 850 MHz (LTE Band 5) band (downlink: 869 - 894 MHz, uplink: 824 - 849 MHz) , LTE2600 (B7)LTE2600 phones support LTE 2600 MHz (LTE Band 7) band (downlink: 2620 - 2690 MHz, uplink: 2500 - 2570 MHz) , LTE900 (B8)LTE900 phones support LTE 900 MHz (LTE Band 8) band (downlink: 925 - 960 MHz, uplink: 880 - 915 MHz) , LTE700 (B12)LTE700 phones support LTE 700 MHz (LTE Band 12) band (downlink: 728 - 746 MHz, uplink: 698 - 716 MHz) , LTE700 (B13)LTE700 phones support LTE 700 MHz (LTE Band 13) band (downlink: 746 - 756 MHz, uplink: 777 - 787 MHz) , LTE700 (B17)LTE700 phones support LTE 700 MHz (LTE Band 17) band (downlink: 734 - 746 MHz, uplink: 704 - 716 MHz) , LTE800 (B19)LTE800 phones support LTE 800 MHz (LTE Band 19) band (downlink: 875 - 890 MHz, uplink: 830 - 845 MHz) , LTE800 (B20)LTE800 phones support LTE 800 MHz (LTE Band 20) band (downlink: 791 - 821 MHz, uplink: 832 - 862 MHz) , LTE850 (B26)LTE850 phones support LTE 850 MHz (LTE Band 26) band (downlink: 859 - 894 MHz, uplink: 814 - 849 MHz) , LTE700 (B28)APT700 phones support LTE 700 MHz (LTE Band 28) band (downlink: 758 - 803 MHz, uplink: 703 - 748 MHz) , LTE700 (B29)LTE Band 29 band (downlink: 716 - 728 MHz) is for carrier aggregation , LTE1500 (B32)LTE Band 32 band (downlink: 1452 - 1496 MHz) , TD-LTE2600 (B38)TD-LTE 2600 MHz phones support TD-LTE 2600 MHz (LTE Band 38) band (2570 - 2620 MHz) , TD-LTE1900 (B39)TD-LTE 1900 MHz phones support Chinese TD-LTE 1900 MHz (LTE Band 39) band (1880 - 1920 MHz) , TD-LTE2300 (B40)TD-LTE 2300 phones support Chinese TD-LTE 2300 MHz (LTE Band 40) band (2300 - 2400 MHz) , TD-LTE2500 (B41)TD-LTE 2500 MHz phones support TD-LTE 2500 MHz (LTE Band 41) band (2496 - 2690 MHz) , LTE1700/2100 (B66)LTE Band 66 (AWS-3) band (downlink band: 2110 - 2200 MHz, uplink band: 1710 - 1780 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  GPRSGeneral Packet Radio Service , EDGEEnhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , EDGE MSC33 , UMTSUniversal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPAHigh-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 5.8 , HSDPAHigh-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 , HSPA+ 42.2Single-carrier HSPA+ 42.2 Mbps , LTELTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 100/50LTE 100.8 Mbps / 50.4 Mbps (Cat. 3) , LTE 150/50LTE 151.2 Mbps / 50.4 Mbps (Cat. 4) , LTE 300/50More exact values: LTE 301.5 Mbps / 50.4 Mbps (Cat. 6) , LTE 300/75LTE 299.6 Mbps / 75.6 Mbps (Cat. 5) , LTE 300/100More exact values: LTE 301.5 Mbps / 100.8 Mbps (Cat. 7) , LTE 400/150LTE Category 13: 391.7 Mbps downlink, 150.8 Mbps uplink (rel. 12) , LTE 450/50LTE Category 9: 452.2 Mbps downlink, 51 Mbps uplink , LTE 450/100LTE Category 10: 452.2 Mbps downlink, 102 Mbps uplink , LTE 600/50LTE Category 11: 603 Mbps downlink, 51 Mbps uplink , LTE 600/100LTE Category 12: 603 Mbps downlink, 102 Mbps uplink (Rel. 11) , LTE 1000/100LTE Category 16: 979 Mbps downlink, 5 CA, 105 Mbps uplink data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  Nano-SIM (4FF)
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrate , Speakerphone , ANCActive noise cancellation (ANC) , HD Voice , VoLTE
SAR (head)Measured SAR value at head configuration 0.778 W/kg
SAR (body)Measured SAR value at body configuration 0.737 W/kg
SAR (hotspot)Measured SAR value at head worst configuration 1.073 W/kg

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch screen

Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSDXCA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 3.0 / 3.1 Gen 1 / 3.2 Gen 1x1Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then USB 3.2 Gen 1x1
USB HS (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB fast chargingFast charging is supported , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB OTG 1.3 , USB OTG 2.0 , USB PDDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB C reversible
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.0Released in Dec, 2016
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  802.11aShort range standard, 5 GHz, max. 54 Mbit/s , 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  DLNADLNA (Digital Living Network Alliance) over Wireless LAN , MiracastMiracast screensharing standard uses Wi-Fi Direct connection , Wi-Fi Direct
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.  NFC AISO/IEC 14443 Type A , NFC BISO/IEC 14443 Type B

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No


Satellite NavigationSatellite Navigation: 
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS , A-GPS , Geotagging , QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Image Sensor Pixel SizePixel size of the primary camera sensor 1.22 micrometer
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 19.2 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.00
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
8.0 x digital zoomDigital zoom is an image signal processing method which cuts out and enlarges a desired part of the captured image while losing the rest of the image
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  CD AFContrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens. , PD AFPhase-detection (PD) is a passive autofocus system which measures the phase difference between a two images to reach correct focus. , Laser AFLaser AF is an active autofocus system which emits infrared beam to precisely measure the distance of the subject. , MFAdjustable focus optical system without a control system.
Min. Equiv. Focal LengthMinimum focal length (35 mm equivalent) of lens or fixed focal length (35 mm equivalent) in case of lens without optical zoom. 25 mm
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 4096x2160 pixel
30 fpsRecording frame rate when recording video at maximum resolution
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  single LEDAlso known as mobile light
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  EISEIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , EIS (video) , HDR photoHigh dynamic range image recording , HDR videoHigh-dynamic-range video recording , Red-eye reduction , Slow motion videoSlowmo cameras are able to achieve at least 100 frame per second frame rate. , Burst mode , Touch focus , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 4.9 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/2.20
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 3840x2160 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  EISEIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , EIS (video) , HDR photoHigh dynamic range image recording , Burst mode , Touch focus , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D accelerometer
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D gyro
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Barometer , FP sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor placed at the front, rear or any side of the device , Gesture sensor , Hall , L sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , P sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  6 Totally protected from dust
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  8 Protected against immersion beyond 1m of depth

Power SupplyPower Supply: 
BatteryBattery technology  Li-ion
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 2870 mAh battery

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  Austria , Belgium , Cyprus , Czech , Denmark , Finland , France , Germany , Greece , Hungary , Ireland , Italy , Luxembourg , Netherlands , Norway , Poland , Portugal , Romania , Russia , Slovakia , Slovenia , South Korea , Spain , Sweden , Switzerland , UKUnited Kingdom (UK)
Market RegionsRegions where the device was officially sold. Overlap is possible.  Asia , Eastern Europe , Europe , Southeast Asia , Western Europe
Mobile OperatorList of mobile operators (carriers) or distributors which sold the device in their own network Bouygues TelecomBouygues Telecom
Free Mobile FRFree Mobile FR
O2 GermanyO2 Germany
SFRSFR
T-Mobile AustriaT-Mobile Austria
T-Mobile PolskaT-Mobile Polska
Telenor NorwayTelenor Norway

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2018-02-27 21:56
 

Sony Xperia XZ2 Compact Global TD-LTE H8314 / PF32 (Sony Apollo)

Sony Xperia XZ2 Compact Global TD-LTE H8314 / PF32 (Sony Apollo)
Platform: android Supported Cellular Bands: gsm Supported Cellular Data Links: gprs Supported Cellular Data Links: edge Supported Cellular Data Links: umts Supported Cellular Data Links: hspa Supported Cellular Data Links: hspa_plus Supported Cellular Data Links: lte Supported Cellular Data Links: lte-a Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone Expansion Interfaces USB: usb3 USB Services: usb_otg USB Connector: usb_c Bluetooth Wireless LAN NFC Complementary Satellite Services Supported GLONASS protocol(s) Supported BeiDou system (BDS) Number of effective pixels: 19.2 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 4.9 MP sec. cam Built-in compass Built-in accelerometer Built-in gyroscope Additional sensors: barometer Additional sensors: fingerprint Protection from liquids: waterproof

Predecessor Model

Sony Xperia XZ1 Compact TD-LTE G8441 / PF41 (Sony Lilac)
Sony Xperia XZ1 Compact TD-LTE G8441 / PF41 (Sony Lilac)
65x129x9.3 mm, Google Android 8.0 (Oreo), Qualcomm Snapdragon 835 MSM8998, 4 GiB RAM, 32 GB ROM, 4.6 inch, 720x1280, 19.2 MP camera, 8.0 MP sec. cam, 2700 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

See also

Sony Xperia XZ2 Compact Global TD-LTE SO-05K (Sony Apollo)
Sony Xperia XZ2 Compact Global TD-LTE SO-05K (Sony Apollo)
64.9x135x12.1 mm, Google Android 8.0 (Oreo), Qualcomm Snapdragon 845 SDM845 (Napali), 4 GiB RAM, 64 GB ROM, 5 inch, 1080x2160, 19.2 MP camera, 5.0 MP sec. cam, 2760 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia XZ2 Compact Global Dual SIM TD-LTE H8324 (Sony Apollo)
Sony Xperia XZ2 Compact Global Dual SIM TD-LTE H8324 (Sony Apollo)
64.9x135x12.1 mm, Google Android 8.0 (Oreo), Qualcomm Snapdragon 845 SDM845 (Napali), 4 GiB RAM, 64 GB ROM, 5 inch, 1080x2160, 19.2 MP camera, 4.9 MP sec. cam, 2870 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 10 VI 5G Dual SIM TD-LTE APAC 128GB XQ-ES72 (Sony PDX-246)
Sony Xperia 10 VI 5G Dual SIM TD-LTE APAC 128GB XQ-ES72 (Sony PDX-246)
PM-1484-BV, 68x155x9.3 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 6 Gen 1 5G SM6450, 8 GiB RAM, 128 GB ROM, 6.1 inch, 1080x2520, 48.0 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES44 (Sony PDX-246)
Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES44 (Sony PDX-246)
PM-1480-BV, 68x155x9.3 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 6 Gen 1 5G SM6450, 6 GiB RAM, 128 GB ROM, 6.1 inch, 1080x2520, 48.0 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES24 A402SO (Sony PDX-246)
Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES24 A402SO (Sony PDX-246)
PM-1483-BV, 68x155x9.3 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 6 Gen 1 5G SM6450, 6 GiB RAM, 128 GB ROM, 6.1 inch, 1080x2520, 48.0 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES04 SO-52E (Sony PDX-246)
Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES04 SO-52E (Sony PDX-246)
PM-1481-BV, 68x155x9.3 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 6 Gen 1 5G SM6450, 6 GiB RAM, 128 GB ROM, 6.1 inch, 1080x2520, 48.0 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES14 SOG14 (Sony PDX-246)
Sony Xperia 10 VI 5G Dual SIM TD-LTE JP 128GB XQ-ES14 SOG14 (Sony PDX-246)
PM-1482-BV, 68x155x9.3 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 6 Gen 1 5G SM6450, 6 GiB RAM, 128 GB ROM, 6.1 inch, 1080x2520, 48.0 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 10 VI 5G Global Dual SIM TD-LTE 128GB XQ-ES54 (Sony PDX-246)
Sony Xperia 10 VI 5G Global Dual SIM TD-LTE 128GB XQ-ES54 (Sony PDX-246)
PM-1485-BV, 68x155x9.3 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 6 Gen 1 5G SM6450, 8 GiB RAM, 128 GB ROM, 6.1 inch, 1080x2520, 48.0 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 1 VI 5G UW Dual SIM TD-LTE NA 256GB XQ-EC64 (Sony PDX-245)
Sony Xperia 1 VI 5G UW Dual SIM TD-LTE NA 256GB XQ-EC64 (Sony PDX-245)
PM-1491-BV, 74x162x8.2 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 SM8650-AB (Lanai), 12 GiB RAM, 256 GB ROM, 6.5 inch, 1080x2340, 30.0 W charging, 12.0 MP camera, 12.2 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 1 VI 5G UW Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC24 A401SO (Sony PDX-245)
Sony Xperia 1 VI 5G UW Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC24 A401SO (Sony PDX-245)
PM-1495-BV, 74x162x8.2 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 SM8650-AB (Lanai), 12 GiB RAM, 256 GB ROM, 6.5 inch, 1080x2340, 30.0 W charging, 12.0 MP camera, 12.2 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 1 VI 5G UW Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC14 SOG13 (Sony PDX-245)
Sony Xperia 1 VI 5G UW Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC14 SOG13 (Sony PDX-245)
PM-1494-BV, 74x162x8.2 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 SM8650-AB (Lanai), 12 GiB RAM, 256 GB ROM, 6.5 inch, 1080x2340, 30.0 W charging, 12.0 MP camera, 12.2 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 1 VI 5G UW Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC04 SO-51E (Sony PDX-245)
Sony Xperia 1 VI 5G UW Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC04 SO-51E (Sony PDX-245)
PM-1493-BV, 74x162x8.2 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 SM8650-AB (Lanai), 12 GiB RAM, 256 GB ROM, 6.5 inch, 1080x2340, 30.0 W charging, 12.0 MP camera, 12.2 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 1 VI 5G Standard Edition Dual SIM TD-LTE JP 512GB XQ-EC44 (Sony PDX-245)
Sony Xperia 1 VI 5G Standard Edition Dual SIM TD-LTE JP 512GB XQ-EC44 (Sony PDX-245)
PM-1496-BV, 74x162x8.2 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 SM8650-AB (Lanai), 12 GiB RAM, 512 GB ROM, 6.5 inch, 1080x2340, 30.0 W charging, 12.0 MP camera, 12.2 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 1 VI 5G Premium Edition Dual SIM TD-LTE JP 512GB XQ-EC44 (Sony PDX-245)
Sony Xperia 1 VI 5G Premium Edition Dual SIM TD-LTE JP 512GB XQ-EC44 (Sony PDX-245)
PM-1496-BV, 74x162x8.2 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 SM8650-AB (Lanai), 16 GiB RAM, 512 GB ROM, 6.5 inch, 1080x2340, 30.0 W charging, 12.0 MP camera, 12.2 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sony Xperia 1 VI 5G Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC44 (Sony PDX-245)
Sony Xperia 1 VI 5G Standard Edition Dual SIM TD-LTE JP 256GB XQ-EC44 (Sony PDX-245)
PM-1496-BV, 74x162x8.2 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 SM8650-AB (Lanai), 12 GiB RAM, 256 GB ROM, 6.5 inch, 1080x2340, 30.0 W charging, 12.0 MP camera, 12.2 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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You are here: Device Specs \ Sony Xperia XZ2 Compact Global TD-LTE H8314 / PF32 (Sony Apollo)
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