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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Apple
Type A17 Pro APL1002 / APL1V02
Codename T8130
Year Released 2023
FunctionMain function of the component  Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8.6-A (A32, A64)
Number of processor core(s) 6
Type of processor core(s)Type and allocation of processor core(s) 2x Apple Everest + 4x Apple Sawtooth cores

BusesBuses: 
Memory Interface(s):   LPDDR4x SDRAM , LPDDR5 SDRAM
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface , SATASATA revision 1.0 (2003) offering 1.5 Gbit/s data rate , SATA IISerial AT Attachment revision 2.0 (released in 2004) or 2.x offering 3 Gbit/s data rate , UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface , UFS 3.1 2-laneComplies with dual-lane Universal Flash Storage 3.1 revision offering 2.9 GB/s NAND flash data rate , UFS 4.0UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 3780 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 128 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 64 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 20480 Kbyte L2
Total L3 Cache 24576 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 3 nm
Semiconductor Technology:   FinFETMultigate (usually double-gate) MOSFET transistor technology
Number of Transistors Integrated 19000000000
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Apple A17 GPU
Number of GPU cores 6-core GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate. , USB 3.0 / USB 3.1 Gen 1 / USB 3.2 Gen 1x1Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then  USB 3.2 Gen 1x1 , USB 3.1 Gen 2 / USB 3.2 Gen 2x1Released in July, 2013, USB 3.1 Gen 2 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0. Later renamed as USB 3.2 Gen 2x1
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   HDMI (Unspecified)

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   GPS (NMEA 0183)NMEA 0183
Supported Galileo service(s)Galileo is a global satellite  navigation system operated by European Union and the European Space Agency.  Yes
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1cBeiDou-3 B1C signals, transmitted by Medium Earth Orbit (MEO) satellites and the Inclined GeoSynchronous Orbit (IGSO) satellites of BDS-3, are centered at 1575.42 MHz and feature a BOC(1,1) modulation , B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation , B2aBeiDou-3 B2a signals, transmitted by Medium Earth Orbit (MEO) satellites and the Inclined GeoSynchronous Orbit (IGSO) satellites of BDS-3, are centered at 1176.45 MHz BeiDou receiver

Additional InformationAdditional Information: 
Special Features
2x high-performance 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores (up to 3.78 GHz, 8 MiB L2 cache per core) + 4x high-efficiency 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores (up to 2.11 GHz, 1 MiB L2 cache per core), HMP, 24 MiB system cache, ARM VFPv4, 16-core NPU, 8K 60 fps HDR video encode, 8K 60 fps HDR video decode, OpenCL, OpenGL 3.1, Vulkan, DirectX 12.1, USB 3.2 Gen 2

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2023-11-22 12:39
 
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