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Processor Specs: Referred (not editable) comparison sheet [2]

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Qualcomm Snapdragon 690 5G SM6350
Qualcomm Snapdragon 678 SM6150-AC
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Qualcomm Snapdragon 690 5G SM6350
Qualcomm Snapdragon 678 SM6150-AC
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Generel CharacteristicsGenerel Characteristics
Year Released 2020 2020
FunctionMain function of the component Multi-core Application Processor with Modem Multi-core Application Processor with Modem

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit 64 bit
Supported Instruction Set(s) ARMv8.3 (A32, A64) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 8x Qualcomm Kryo 560 2x Qualcomm Kryo 460 + 6x Qualcomm Kryo 360
Number of processor core(s) octa-core octa-core

BusesBuses
Memory Interface(s) LPDDR4x SDRAM LPDDR4 SDRAM, LPDDR4x SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1866 MHz 1866 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 16 bit 16 bit
Number of data bus channels 2 ch 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 14.93 Gbyte/s 14.93 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory eMMC 5.1, UFS 2.1, UFS 2.2 UFS 2.1

Clock FrequenciesClock Frequencies
Recommended Maximum Clock Frequency 2000 MHz max. 2200 MHz max.

Cache MemoriesCache Memories
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 896 Kbyte L2
Total L3 Cache 1024 Kbyte L3



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 8 nm 11 nm
Semiconductor Technology CMOS CMOS
FabPlant which fabricates the semiconductor component Samsung Samsung

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 619L GPU Qualcomm Adreno 612 GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 0.25 MiB

Cellular CommunicationCellular Communication
Supported Cellular Data LinksList of supported cellular data links CSD, GPRS, EDGE, UMTS, HSUPA, HSUPA 5.8, HSUPA 11.5, HSDPA, HSPA+ 21.1, DC-HSDPA 42.2, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, LTE, LTE 100/50, LTE 150/50, LTE 300/50, LTE 300/75, LTE 300/100, LTE 400/150, LTE 450/50, LTE 450/100, LTE 600/50, LTE 600/100, LTE 1000/100, LTE 1200/200, NR 1500, NR 2600 data links CSD, GPRS, EDGE, UMTS, HSUPA, HSUPA 5.8, HSUPA 11.5, HSDPA, HSPA+ 21.1, DC-HSDPA 42.2, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, LTE, LTE 100/50, LTE 150/50, LTE 300/50, LTE 300/75, LTE 300/100, LTE 400/150, LTE 450/100, LTE 600/50, LTE 600/100 data links

Additional InformationAdditional Information
Special Features 2x Qualcomm Kryo 560 Gold (ARM Cortex-A77, up to 2 GHz) + 6x Qualcomm Kryo 560 Silver (ARM Cortex-A55, up to 1.7 GHz) Harvard Superscalar cores, HMP, Hexagon 692 DSP, Qualcomm X51 5G NR Modem, CDMA 2000 1x Adv./DO Rel.. 2x Qualcomm Kryo 460 (up to 2.2 GHz, ARM Cortex-A76, 256 Kbyte L2 cache per core) + 6x Qualcomm Kryo 360 (ARM Cortex-A55, 64 Kbyte L2 cache per core) Harvard Superscalar cores, HMP, Hexagon 685 DSP, Qualcomm X12 LTE..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2020-08-19 12:46 2021-01-07 08:51

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