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Qualcomm Snapdragon 805 APQ8084 (8084 Fusion 4)

Qualcomm Snapdragon 801 APQ8074AB v3

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Qualcomm Snapdragon 805 APQ8084 (8084 Fusion 4)

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Generel Characteristics

Year Released

2014

Function Main function of the component

Multi-core Application Processor

Architecture

Width of Machine Word Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.

32 bit

Supported Instruction Set(s)

ARMv7-A

ARMv7

Pipeline Stages Pipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions.

11 pipeline stages

Type of processor core(s) Type and allocation of processor core(s)

4x Qualcomm Krait 450

4x Qualcomm Krait 400

Number of processor core(s)

quad-core

Buses

Memory Interface(s)

LPDDR3 SDRAM

Max. Clock Frequency of Memory IF Clock frequency of fastest supported memory interface

800 MHz

933 MHz

Data Bus Width Maximum selectable bit width of primary data bus (RAM) of memory interface

16 bit

32 bit

Number of data bus channels

4 ch

2 ch

Max. Data Rate Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.

12.8 Gbyte/s

14.93 Gbyte/s

Non-volatile Memory Interface Interface which determines physical layer towards the NV memory

eMMC 5.0

Clock Frequencies

Recommended Maximum Clock Frequency

2500 MHz max.

2265 MHz max.

Cache Memories

L0 Instruction Cache per Core Capacity of level 0 instruction cache per processor core

4 Kbyte L0 I-Cache

L0 Data Cache per Core Capacity of level 0 data cache per processor core

4 Kbyte L0 D-Cache

L1 Instruction Cache per Core Capacity of level 1 instruction cache per processor core

16 Kbyte I-Cache

L1 Data Cache per Core Capacity of level 1 data cache per processor core

16 Kbyte D-Cache

Total L2 Cache Capacity of level 2 cache shared between processor core(s)

2048 Kbyte L2

Technology and Packaging

Feature Size The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology

28 nm

Semiconductor Technology

CMOS

Fab

TSMC

Graphical Subsystem

Embedded GPU Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).

Qualcomm Adreno 420 GPU

Qualcomm Adreno 330 GPU

GPU Clock

500 MHz GPU

578 MHz GPU

Dedicated Graphics Memory Dedicated operative memory (video RAM, VRAM)

1.5 MiB

1 MiB

Cellular Communication

Additional Information

Special Features

4x Qualcomm Krait 450 Harvard Superscalar processor core, Hexagon V50 DSP, OpenGL ES 3.0, OpenCL 1.2, OpenVG 1.1, EGL 3.1, DirectX 11, 55 MP camera support, Stereoscopic 3D Kit, 2160p video encode/decode, Qualcomm iZAT Gen8B with GLONASS, BeiDou, USB 3.0,..

4x Qualcomm Krait 400 Harvard Superscalar processor core, 465 MHz ISP, 55 MP camera support, Stereoscopic 3D Kit, 2160p video encode/decode, gpsOneGen 8B with GLONASS, USB 3.0, OpenGL ES 3.0, OpenCL 1.1, OpenVG 1.1, EGL 3.1, DirectX 11. Snapdragon 800..

Datasheet Attributes

Data Integrity Data integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b

Preliminary

Added

2013-11-21 11:35

2014-02-26 16:41