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Processor Specs: Referred (not editable) comparison sheet [2]

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Apple A5 APL0498 (S5L8940)
Apple A5X APL5498 (S5L8945X)
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Apple A5 APL0498  (S5L8940)
Apple A5X APL5498  (S5L8945X)
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Generel CharacteristicsGenerel Characteristics
Year Released 2011 2012
FunctionMain function of the component SoC SoC

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit 32 bit
Supported Instruction Set(s) ARMv7 ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 8 pipeline stages 8 pipeline stages
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A9 MPcore 2x ARM Cortex-A9 MPcore
Number of processor core(s) dual-core dual-core

BusesBuses
Memory Interface(s) LPDDR2 SDRAM LPDDR2 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 533 MHz 400 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit 32 bit
Number of data bus channels 1 ch 1 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 8.53 Gbyte/s 3.2 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory eMMC 5.1, moviNAND, NAND Flash Interface, SATA moviNAND, NAND Flash Interface, SATA

Clock FrequenciesClock Frequencies
Recommended Minimum Clock Frequency 800 MHz min.
Recommended Maximum Clock Frequency 1200 MHz max. 1000 MHz max.

Cache MemoriesCache Memories
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 512 Kbyte L2 1024 Kbyte L2



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 45 nm 45 nm
Semiconductor Technology CMOS CMOS
FabPlant which fabricates the semiconductor component Samsung Samsung

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). IMG PowerVR SGX543 GPU IMG PowerVR SGX543 GPU
Number of GPU cores 2-core GPU 4-core GPU
GPU Clock 250 MHz GPU

Cellular CommunicationCellular Communication

Additional InformationAdditional Information
Special Features dual ARM Cortex-A9 Harvard Superscalar processor core, 64/32-bit Multi-layer AHB/AXI bus, ARM TrustZone, ARM NEON SIMD engine, 512MB dual-channel (64-bit) 266 MHz LPDDR2-1066 SDRAM, NAND flash, moviNAND, SATA, eMMC interface, embedded GPS module, HDMI, triple display controller, 1080p video encode,.. dual ARM Cortex-A9 Harvard Superscalar processor core, 64/32-bit Multi-layer AHB/AXI bus, ARM TrustZone, ARM NEON SIMD engine, 400 MHz 32-bit LPDDR2 SDRAM interface, NAND flash, moviNAND, SATA, eMMC interface, embedded GPS module, HDMI, triple display controller, 1080p video encode, 1080p..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2011-03-05 10:58 2012-03-07 21:50

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