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Device Specs Parametric Search Tool form has been modified: !The form contains modified fields which are now marked to find them easier.
Jump to resultsJump to results | Jump to sectionJump to section Application processor, Chipset | Operative Memory | Non-volatile Memory | Display | Graphical Subsystem | Audio/Video Interfaces | Audio Subsystem | Cellular Phone | Secondary Cellular Phone | Control Peripherals | Communication Interfaces | Multimedia Broadcast | Satellite Navigation | Primary Camera System | Secondary Camera System | Built-in Sensors | Ingress Protection | Power Supply | Geographical Attributes

Introduction

Introduction

Brand name of the device. This may match with the manufacturer Brand
One or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated Model
Release date in YYYY-MM-DD format or in YYYY-MM format if exact day is not known. 1970-01-01 refers to invalid date or cancalled product Release Date
from: to:
The company which designed this device Hardware Designer
The company which produces this device Manufacturer
The codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename Codename
The OEM ID is internal code and refers to a specific variant of the model series OEM ID
Hardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). General Extras:
Smartphone, tablet, smart watch, PDA, palmtop, etc. Device Category:
Physical Attributes

Physical Attributes

Width is horizontally measured between the left and right edges of device according to the default display orientation Width
min: max:  mm
Width measured in inches Width
min: max:  inch
Height is vertically measured between the bottom and top edges of device according to the default display orientation Height
min: max:  mm!
Height measured in inches Height
min: max:  inch
Depth refers to the thickness of the device. Depth is usually the smallest dimension of the device Depth
min: max:  mm
Depth measured in inches Depth
min: max:  inches
The volume of the smallest cuboid which can bound the device in cubecentimetres Bounding Volume
min: max:  ccm
The mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams Mass
min: max:  g
The mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces Mass
min: max:  ounces
Software Environment

Software Environment

The family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc. Platform:
Pre-installed (usually embedded) operating system which the device was released with.. If you select more than one specific options results having ANY of the selected options will be included ("OR" relation). Operating System
Alibaba:
Apple:
Borqs:
Canonical:
Debian Project:
Garmin:
GeoWorks:
Google:
HP:
Huawei:
Jolla:
KaiOS Technologies:
LG:
LiMo Foundation:
Linux Foundation:
Microsoft:
Mozilla:
Nokia:
Palm:
Palm Computing:
PalmSource:
Qualcomm:
Real Time Engineers:
RIM:
Samsung:
Symbian:
Tencent:
Trolltech:
Navigation software, voice recognition, face recognition, personal assistant app, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Software Extras:
Application processor, Chipset

Application processor, Chipset

Frequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. CPU Clock
min: max:  MHz
Manufacturer part number and most important characteristics of the IC which includes the main application processor or processors. If you select more than one specific options results having ANY of the selected options will be included ("OR" relation). CPU
Actions Semiconductor:
Allwinner:
AMD:
Amlogic:
Apple:
ARM:
Broadcom:
Centrality:
Cirrus Logic:
DEC:
Freescale:
HiSilicon:
Hitachi:
Ingenic:
Intel:
JLQ:
Leadcore:
LG:
MagicEyes:
Marvell:
MediaTek:
Motorola:
NEC:
Nokia:
NVIDIA:
Philips:
Qualcomm:
RMI:
Rockchip:
Samsung:
Samsung-Intrinsity:
SiRF:
Sony:
Spreadtrum:
ST-Ericsson:
STMicroelectronics:
Telechip:
Texas Instruments:
Toshiba:
UNISOC:
VIA:
Xiaomi:
ZiiLABS:
Operative Memory
Operative Memory
Type of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM). RAM Type:
Clock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate RAM Databus Clock
min: max:  MHz
Capacity of the random access memory in mebibytes (binary megabytes) RAM Capacity
min: max:  MiB RAM
RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) RAM Capacity (converted)
RAM space that unprotected system and user tasks can access Accessible RAM space
min: max:  MiB user accessible RAM
Manufacturer part number of the RAM IC RAM IC
Non-volatile Memory
Non-volatile Memory
Type of NV memory IC which determines storage technology, programming / erasing method and write endurance Non-volatile Memory Type:
Interface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory Non-volatile Memory Interface:
Non-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi Non-volatile Memory Capacity
min: max:  MiB non-volatile
The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) Non-volatile Memory Capacity (converted)
Manufacturer part number of the primary NV memory IC. Non-volatile Memory IC
Capacity of the secondary non-volatile memory in mebibytes (binary megabytes) Secondary Non-volatile Memory Capacity
min: max:  MiB
The value of sec. ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) Secondary Non-volatile Memory Capacity
Capacity of the built-in hard disk (HDD) in megabytes (million bytes) Hard Disk Capacity
min: max:  MB
Display

DisplayAll parameters that related to display

Number of display notches (or cutouts) Display Notch
min: max:  -notch
Number of in-display camera or sensor holes Display Hole
min: max:  -hole
Display Diagonal in inches Display Diagonal
min: max:  inch
Number of horizontal pixels in one row. The distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the smallest bounding rectangle. Horizontal Resolution
min: max:  pixel
Number of vertical pixels in one column. In case of display with rounded edges this refers to the smallest bounding rectangle. Vertical Resolution
min: max:  pixel
Defined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. Horizontal Full Bezel Width
min: max:  mm
Regular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. Display Area Utilization
min: max:  %
Indicates the number of pixels per inch Pixel Density
min: max:  PPI
Display technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT Display Type:
Brand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBlack, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Display Subtype:
Color depth defines how many colors or greyscales can be displayed Display Color Depth
min: max:  bit/pixel
Bit depth of the dynamic range defines the luminance ratio between the brightest and the darkest state of a pixel (HDR10: 10 bit, HDR10+: 12 bit) Display Dynamic Range Depth
min: max:  bit/pixel
Form of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions. Display Illumination:
The ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc. Display Light Reflection Mode:
Specifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel Display Subpixel Scheme:
Frame refresh frequency of the main display Display Refresh Rate
min: max:  Hz
Usual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass Scratch Resistant Screen:
Secondary Display Diagonal
min: max:  inch
Secondary Display Horizontal Resolution
min: max:  pixel
Secondary Display Vertical Resolution
min: max:  pixel
Secondary Display Type:
Secondary Display Color Depth
min: max:  bit/pixel
Secondary Display Dyn. Range Depth
min: max:  bit/pixel
Frame refresh frequency of the secondary display Secondary Display Refresh Rate
min: max:  Hz
Graphical Subsystem
Graphical Subsystem
Manufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Graphical Controller
GPU Clock
min: max:  MHz
Audio/Video Interfaces
Audio/Video Interfaces
Audio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e A/V Out:
Physical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25 A/V Out Connector:
The largest resolution supported by video out A/V Out Max. Resolution:
Allows the device to be used as an external display for another device which has A/V out A/V In:
Physical interface of the A/V input port. A/V In Connector:
Audio Subsystem

Audio Subsystem

Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc. Audio Channel(s):
Manufacturer and part number of the audio controller IC or commercial name of the intellectual property (IP) if the audio controller is the part of a chipset Audio Controller
The resulution (Q) of the analog/digital converter which converts the analog voltage signal of the built-in microphone or microphone input to a series of Q-wide binary samples A/D Converter Nominal Resolution
min: max:  bit quantization
The maximum sampling frequency of the analog/digital converter A/D Sampling Frequency
min: max:  Hz
Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification Microphone(s):
This jack allows the user to connect external microphone to the device Microphone Input:
The resulution (R) of the digital/analog converter which converts a series of R-wide binary samples to the analog voltage signal of the built-in speaker or audio out D/A Converter Nominal Resolution
min: max:  bit quantization
The maximum holding frequency of the digital/analog converter D/A Holding Frequency
min: max:  Hz
Loudspeaker(s):
The maximal electrical power per speaker. Loudspeaker Power
min: max:  W
Audio Output:
Cellular Phone

Cellular Phone

List of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Supported Cellular Bands:
List of supported cellular data links and rates.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Supported Cellular Data Links:
Supported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). SIM Card Slot:
Polyphonic or monophonic call alert sound (number of chords) Call Alert Sound
Hearing Aid Compatibility (HAC) rate, For example: M3/T4. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Hearing Aid Compatibility (HAC):
Possible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Complementary Phone Services:
Manufacturer part number of the cellular modem and controller IC or commercial name of the intellectual property (IP) if the function is the part of a chipset Cellular Controller
Secondary Cellular Phone
Secondary Cellular Phone
Determines how the device can handle multiple cellular networks and SIM cards. For example dual-standy, dual-active Dual Cellular Network Operation:
. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Sec. Supported Cellular Data Links:
Secondary Supported Subscriber Identification Card (SIM) Format. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Sec. SIM Card Slot:
Control Peripherals

Control Peripherals

Determines how the touchscreen module senses the touch of the screen Touchscreen Type:
Determines how many touches the touch-sensitive screen module is able to simultaneously detect at most Touchscreen Simultaneous Touch Points:
Maximal sampling frequency of the touch-sensitive screen module. Maximal sampling rate is usually not available at maximal number of touch points Touchscreen Sampling rate
min: max:  Hz
Determines how the touchpad, trackpad or other touch surface module senses the touch of the surface Touch Surface Type:
Determines how many touches the touch-sensitive surface is able to simultaneously detect Touch Surface Simultaneous Touch Points:
Conventional input peripheral which allows the user to enter characters by pressing a dedicated key Keyboard:
Phones and some palmtops, netbooks, notebooks, rugged computers have keyboard backlighting to help the user with typing in dim ambient conditions Keyboard Backlight:
The total number of keys in case of QWERTY or other standard keyboards OR the number of keys excluding navigation buttons in case of special keybaords Number of keys
min: max:  
A four-way mechanism that allows the selection of certain on-screen objects Directional Pad:
Scroll Wheel, jog and rotary machanisms to help user with scrolling on the screen Scroll Wheel:
Communication Interfaces

Communication Interfaces

Non-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Expansion Interfaces:
First or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard. USB:
Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS). If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). USB Speed Rate:
Possible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). USB Services:
Physical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning) USB Connector:
Multiplication of maximal charging current and maximal battery voltage during battery recharging Max. Charging Power
min: max:  W
IEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version. Bluetooth:
List of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Bluetooth profiles:
Manufacturer part number of the phone controller IC or commercial name of the intellectual property (IP) if the phone controller is the part of a chipset Bluetooth Controller IC
Wireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Wireless LAN:
Possible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Wireless Services:
Manufacturer part number of the WiFi controller IC or commercial name of the intellectual property (IP) if the phone controller is the part of a chipset WLAN Controller IC
Often referred to as 802.16 or WiMax, this is a long range wireless protocol used for data transfer. This field enumerates the supported protocols.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Wireless MAN:
Near Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). NFC:
Infrared Port (IR): Near-field (within 1 meter) wireless optical data link mainly for connecting mobile devices, accessories and consumer electronic devices (remote control). IR:
Determines the highest available data transfer speed of IR port Infrared Data Rate:
Universal Asynchronous Receiver-Transmitter (UART) is a configurable asynchronous serial data link Serial:
Serial Connector:
Serial Data Rate:
Ethernet (IEEE 802.3): High-speed wired connection that allows the transfer of data directly to and from a network or internet source LAN:
LAN Connector:
Modem:
Modem Connector:
Faxmodem:
Multimedia Broadcast

Multimedia Broadcast

. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Analog TV receiver:
Analog TV Antenna:
With a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band. FM Radio Receiver:
In small devices antenna of the FM radio receiver does not fit into the house of the device and external components needed (e.g. headset as antenna or external antenna) FM Radio Antenna:
FM Radio Transmitter:
Digital multimedia (TV/audio) broadcast technologies like T-DMB, ISDB-T 1-seg, ISDB-T HDTV, DAB+, DVB-T, CMMB, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Digital Media Broadcast:
Digital Media Broadcast Antenna:
Satellite Navigation

Satellite Navigation

Possible protocols: NMEA 0183, SIRF, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Supported GPS protocol(s):
Number of parallel GPS channels defines how many satellites the device can monitor at to same time Parallel GPS Channels
min: max:  
Satellite Antenna:
Possible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Complementary Satellite Services:
GLONASS is a global satellite navigation system operated by Russia.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Supported GLONASS protocol(s):
Galileo is a global satellite navigation system operated by European Union and the European Space Agency.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Supported Galileo service(s):
BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Supported BeiDou system (BDS):
Manufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset Navigation Controller
Primary Camera System

Primary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any

Manufacturer part number or commercial name of the primary camera module Camera Module
Refers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.) Camera Image Sensor:
The format of the image sensor determines the physical dimensions of the image sensor. Enter only the float value between 1/ and the unit. Image Sensor Format 1/
min: max:  
Pixel size of the primary camera sensor Image Sensor Pixel Size
min: max:  micrometer
0.1MP: 352x288 (QCIF), 0.3MP: 640x480 (VGA), 1MP: 1280x720 (HD), 1.2MP: 1280x960, 1.3MP: 1280x1024, 2MP: 1600x1200 (1.9MP) or 1920x1080 (2.1MP FHD), 3MP 2048x1536 (3.2MP), 7MP: 3072x2304 (7.1MP), 8MP: 3264x2448 or 3280x2460, 5MP: 2560x1920 or 2592x1944 Number of horizontal pixels
min: max:  
10MP: 3648x2736, 12MP: 4000x3000 or 4016x3008 (12.1MP) or 4032x3024 (12.2MP) or 4048x3036 (12.3MP) or 3968x2976 (11.8MP), 13MP: 4160x3120 or 4208x3120 (13.1MP) or 4096x3072 (12.58MP) or 4224x3120 (13.18MP) Number of vertical pixels
min: max:  
A measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) Number of effective pixels
Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom. Display formats: 1:2.4 or f/2.4. Enter only the denominator. Aperture (W) f/
min: max:  
Telephoto aperture of lens. Display formats: 1:7.2 or f/7.2. Enter only the denominator. Aperture (T) f/
min: max:  
A feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance Zoom
min: max:  x optical zoom
Digital zoom is an image signal processing method which cuts out and enlarges a desired part of the captured image while losing the rest of the image Digital Zoom
min: max:  x digital zoom
CD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Focus:
Minimum focal length (35 mm equivalent) of lens or fixed focal length (35 mm equivalent) in case of lens without optical zoom. Min. Equiv. Focal Length
min: max:  mm
Maximum focal length (35 mm equivalent) Max. Equiv. Focal Length
min: max:  mm
Max. number of horizontal video pixels
min: max:  
Max. number of vertical video pixels
min: max:  
A flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash. Flash:
Popular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Camera Extra Functions:
Auxiliary camera image sensor technology in at least dual lens setup Aux. Camera Image Sensor:
Manufacturer part number or commercial name of the primary aux. camera module Aux. Camera Module
Pixel size of the aux. camera sensor Aux. Cam. Image Sensor Pixel Size
min: max:  micrometer
16MP: 4608x3456 (15.9MP) or 4656x3492 (16.25MP) or 4616x3464 (16MP), 20MP: 5120x3840 (19.7MP) or 5472x3648 (20MP) or 5160x3872 (20MP) or 5184x3880 (20.1MP), 21MP: 5353x4016 (21.5MP), 23MP: 5520x4140 (22.9MP) or 5504x4128 (22.7MP) or 5536x4152 (23MP) Aux. Cam. number of horizontal pixels
min: max:  pixel
24MP: 5632x4224 (23.8MP) or 5656x4240 (24MP), 25MP: 5760x4312 (24.8MP) or 5760x4320 (24.9MP), 32MP: 6528x4896 (32MP), 40MP: 7296x5472, 48MP: 8000x6000 or 8032x6024 (48.4MP), 64MP: 9216x6912 (63,7MP) or 9232x6928 Aux. Cam. number of vertical pixels
min: max:  pixel
Number of effective pixels of Auxiliary Camera (2nd camera of primary camera system) in at least dual lens camera setup Aux. Camera Number of Pixels
Aux. Camera Aperture (W) f/
min: max:  
CD AF, PD AF, etc. No / Not supported means there is no adjustable aux. optical system. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Aux. Camera Focus:
Popular extra features of the aux. camera: OIS, EIS, HDR photo. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Aux. Camera Extra Functions:
Auxiliary 2 camera image sensor technology in at least triple lens setup Aux. 2 Camera Image Sensor:
Aux. 2 Cam. number of horizontal pixels
min: max:  pixel
Aux. 2 Cam. number of vertical pixels
min: max:  pixel
Number of effective pixels of Auxiliary 2 Camera (3rd camera of primary camera system) in at least triple lens camera setup Aux. 2 Camera Number of Pixels
Aux. 2 Camera Aperture (W) f/
min: max:  
Auxiliary 3 camera image sensor technology in at least quad lens setup Aux. 3 Camera Image Sensor:
Auxiliary 4 camera image sensor technology in at least penta lens setup Aux. 4 Camera Image Sensor:
Secondary Camera System

Secondary Camera SystemWidely used for video telephony or taking selfies

Refers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call. Secondary Camera Placement:
Manufacturer part number or commercial name of the secondary camera module Secondary Camera Module
Refers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.) Secondary Camera Sensor:
The format of the image sensor in the secondary camera module Secondary Image Sensor Format 1/
min: max:  
Pixel size of the secondary camera image sensor Secondary Image Sensor Pixel Size
min: max:  micrometer
Secondary Number of horizontal pixels
min: max:  
Secondary Number of vertical pixels
min: max:  
A measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) Secondary Camera Number of pixels
Secondary Aperture (W) f/
min: max:  
Focus methods of secondary camera. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Secondary Camera Focus:
Sec. max. number of horizontal video pixels
min: max:  
Sec. max. number of vertical video pixels
min: max:  
Exact type of flash placed near to secondary camera lens Sec. Built-in Flash:
Popular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Secondary Camera Extra Functions:
Image sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup Sec. Aux. Cam. Image Sensor:
Pixel size of the secondary auxiliary camera image sensor Sec. Aux. Image Sensor Pixel Size
min: max:  micrometer
Sec. Aux. Cam. Number of horizontal pixels
min: max:  
Sec. Aux. Cam. Number of vertical pixels
min: max:  
Sec. Aux. Cam. Aperture f/
min: max:  
Image sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup Sec. Aux. 2 Cam. Image Sensor:
Sec. Aux. 2 Cam. Number of horizontal pixels
min: max:  
Sec. Aux. 2 Cam. Number of vertical pixels
min: max:  
Sec. Aux. 2 Cam. Aperture f/
min: max:  
Built-in Sensors

Built-in Sensors

Built-in electroinc compass types: 1D, 2D, 3D Built-in compass:
An internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D Built-in accelerometer:
An internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D Built-in gyroscope:
Built-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Additional sensors:
Possible types: 1D CCD, 1D LASER, 1D Pen Type Reader, 2D LASER, 2D CCD. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Built-in Barcode Scanner:
Ingress Protection

Ingress Protection

Ingress Protection Standards. IP First digit: Protection from solid objects or materials Protection from solid materials:
Ingress Protection Standards. IP Second digit: Protection from liquids Protection from liquids:
Ingress Protection Standards. IP Third number: Protection against mechanical impacts (commonly omitted). Device is protected against impact with the following potential energy values. example: Protects against impact of 0.225 joule (e.g. 150g body falli Protection against mechanical impacts
min: max:  cm
Device is protected against immersion into this depth of liquid (usually water) at most. (IP rating) Immersion into liquids (depth limit)
min: max:  cm
Protected against immersion into liquids within this time limit (in minutes). (IP rating) Immersion into liquids time limit
min: max:  min
Highest level of Military Standard Compliance Military Standard Compliance (MIL-STD):
Power Supply

Power Supply

Battery technology Battery:
Possible options: removable, built-in Battery Build:
If this field is true the cells of the battery are in parallel connection while discharging. If false the cells of the battery are in serial. Some devices applies serial connection while fast charging and paralel connection while discharging Battery Cells in Parallel
In case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss. Number of Battery Cells
min: max:  -cell
If there are more than 1 cells in the battery in series connection the nominal resulting battery voltage is the sum of voltage of cells Nominal Battery Voltage
min: max:  Volts
If there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells Nominal Battery Capacity
min: max:  mAh battery
The product of battery capacity and nominal voltage determines the maximal nominal stored energy in the battery Nominal Battery Energy
min: max:  Wh
Estimated always-on battery life of the device in case of common usage conditions Estimated Battery Life
min: max:  hours
The maximum standby time of the unused cell phone with active cellular radio (GSM, CDMA, iDEN, TD-SCDMA, WCDMA, LTE) and continuously refreshed dynamic RAM. Standby Time
min: max:  hours
Talk Time
min: max:  hours
Wireless charging (like Qi, PMA) is a kind of near-field electromagnatic power transmission methods. Inductive coupling is created between a mobile device (secondary coil) and a special charger (primary coil), usually docking station or charging pad.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Wireless Charging:
Maximal primer power during wireless battery charging Max. Wireless Charging Power
min: max:  W
Geographical Attributes

Geographical Attributes

Countries where the device was officially sold. Overlap is possible.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Market Countries:
Regions where the device was officially sold. Overlap is possible.. If you select more than one specific options results having ALL of the selected options will be included ("AND" relation). Market Regions:
List of mobile operators (carriers) or distributors which sold the device in their own network. If you select more than one specific options results having ANY of the selected options will be included ("OR" relation). Mobile Operator

Device Specs: Search results by parameters

1807 results match. To reorder results modify your default list order preferences (order field, order mode) at the bottom of Device Specs list thereafter return to and reload this page. Result Pages:

Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
 F741UZOEXAA, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
 F741UZSAXAA, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
 F741ULGEUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
 F741UZSAUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare


Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
 F741ULBEVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741V (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741V (Samsung B6)
 F741UZSAVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741T (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741T (Samsung B6)
 F741UZYEXAU, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741T (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741T (Samsung B6)
 F741ULGAXAU, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741A (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741A (Samsung B6)
 F741ULBEATT, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741A (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741A (Samsung B6)
 F741UZSAATT, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 512GB (Samsung B6)
Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 512GB (Samsung B6)
 F741WZYEXAC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 256GB (Samsung B6)
Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 256GB (Samsung B6)
 F741WAKAXAC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 512GB (Samsung B6)
Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 512GB (Samsung B6)
 F741NZOEKOO, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 256GB (Samsung B6)
Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 256GB (Samsung B6)
 F741NLBAKOO, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 512GB (Samsung B6)
Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 512GB (Samsung B6)
 F7410ZWEBRI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 256GB (Samsung B6)
Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 256GB (Samsung B6)
 F7410LGATGY, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SCG29 (Samsung B6)
Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SCG29 (Samsung B6)
 F741JZYAKDI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB SCG29 (Samsung B6)
Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB SCG29 (Samsung B6)
 F741JZSEKDI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741D Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SC-54E (Samsung B6)
Samsung SM-F741D Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SC-54E (Samsung B6)
 F741DLBADCM, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB (Samsung B6)
Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB (Samsung B6)
 F741QZSESJP, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB (Samsung B6)
Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB (Samsung B6)
 F741QAKASJP, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741B Galaxy Z Flip6 5G Global TD-LTE 512GB (Samsung B6)
Samsung SM-F741B Galaxy Z Flip6 5G Global TD-LTE 512GB (Samsung B6)
 F741BLGHEUE, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741B Galaxy Z Flip6 5G Global TD-LTE 256GB (Samsung B6)
Samsung SM-F741B Galaxy Z Flip6 5G Global TD-LTE 256GB (Samsung B6)
 F741BLBGEUB, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

HTC U24 Pro 5G Global Dual SIM TD-LTE 512GB (HTC Eno U)
HTC U24 Pro 5G Global Dual SIM TD-LTE 512GB (HTC Eno U)
 2QDA100, 74.9x167.1x8.98 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 3 5G SM7550-AB (Crow), 12 GiB RAM, 512 GB ROM, 6.8 inch, 1080x2436, 50.1 MP camera, 50.1 MP sec. cam, 4600 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

HTC U24 Pro 5G Global Dual SIM TD-LTE 256GB (HTC Eno U)
HTC U24 Pro 5G Global Dual SIM TD-LTE 256GB (HTC Eno U)
 2QDA100, 74.9x167.1x8.98 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7 Gen 3 5G SM7550-AB (Crow), 12 GiB RAM, 256 GB ROM, 6.8 inch, 1080x2436, 50.1 MP camera, 50.1 MP sec. cam, 4600 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

General Mobile Era 30 Global Dual SIM TD-LTE 128GB
General Mobile Era 30 Global Dual SIM TD-LTE 128GB
 76x164.5x8.9 mm, Google Android 14 (Upside Down Cake), MediaTek Helio G36 MT6765V, 4 GiB RAM, 128 GB ROM, 6.6 inch, 720x1600, 50.1 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

ZTE Nubia Ivy 5G TD-LTE JP Z6561J (ZTE Z6561)
ZTE Nubia Ivy 5G TD-LTE JP Z6561J (ZTE Z6561)
 76x166x8.6 mm, Google Android 13 (Tiramisu), MediaTek Dimensity 700 MT6833V/ZA, 6 GiB RAM, 128 GB ROM, 6.6 inch, 1080x2408, 50.1 MP camera, 8.0 MP sec. cam, 4420 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

ZTE Libero 5G TD-LTE JP A003ZT Z6650S (ZTE Z6650)
ZTE Libero 5G TD-LTE JP A003ZT Z6650S (ZTE Z6650)
 77x166x9.2 mm, Google Android 11 (R), Qualcomm Snapdragon 690 5G SM6350, 4 GiB RAM, 64 GB ROM, 6.5 inch, 1080x2340, 15.9 MP camera, 8.0 MP sec. cam, 3900 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Sharp Aquos Wish4 5G TD-LTE JP 64GB SH-M27 (Sharp SX4)
Sharp Aquos Wish4 5G TD-LTE JP 64GB SH-M27 (Sharp SX4)
 76x167x8.8 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 700 MT6833V/ZA, 4 GiB RAM, 64 GB ROM, 6.6 inch, 720x1612, 50.1 MP camera, 8.0 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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