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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon S4 MSM8660A
Year Released 2012
FunctionMain function of the component  Multi-core Application Processor with Modem

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 11 pipeline stages
Type of processor core(s)Type and allocation of processor core(s) 2x Qualcomm Krait
Number of processor core(s) dual-core

BusesBuses: 
Memory Interface(s):   LPDDR2 SDRAM
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 1 ch


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1500 MHz min.
Recommended Maximum Clock Frequency 1700 MHz max.

Cache MemoriesCache Memories: 
L0 Instruction Cache per CoreCapacity of level 0 instruction cache per processor core 4 Kbyte L0 I-Cache
L0 Data Cache per CoreCapacity of level 0 data cache per processor core 4 Kbyte L0 D-Cache
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1024 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 230 GPU
GPU Clock 400 MHz GPU

Cellular CommunicationCellular Communication: 

Supported Cellular Data LinksList of supported cellular data links  CSDCircuit Switched Data (CSD) is the original data link protocol of GSM. Up to 9600bit/s download speed , GPRSGeneral Packet Radio Service , EDGEEnhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTSUniversal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPAHigh-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSDPAHigh-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 , CDMA2000 1x , CDMA2000 1xEV-DO , CDMA2000 1xEV-DO Rev A , CDMA2000 1xEV-DO Rev B , TD-SCDMATime Division Synchronous Code Division Multiple Access is the implementation of UMTS  (3G) cellular network in China. data links

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s):   Yes
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes

Additional InformationAdditional Information: 
Special Features 2x Qualcomm Krait Harvard Superscalar core, LPDDR2 SD.. ››

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2012-02-27 10:50
 
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