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Processor Specs: Referred (not editable) comparison sheet [2]

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Qualcomm Snapdragon 865 5G SM8250 (Kona)
Qualcomm Snapdragon 865+ 5G SM8250-AB (Kona)
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Qualcomm Snapdragon 865 5G SM8250  (Kona)
Qualcomm Snapdragon 865+ 5G SM8250-AB  (Kona)
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Generel CharacteristicsGenerel Characteristics
Year Released 2020 2020
FunctionMain function of the component Multi-core Application Processor with Modem Multi-core Application Processor with Modem

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 8x Qualcomm Kryo 585 8x Qualcomm Kryo 585
Number of processor core(s) octa-core octa-core

BusesBuses
Memory Interface(s) LPDDR4x SDRAM, LPDDR5 SDRAM LPDDR4x SDRAM, LPDDR5 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 2750 MHz 2750 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 16 bit 16 bit
Number of data bus channels 4 ch 4 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 44 Gbyte/s 44 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory UFS 3.0, UFS 3.0 2-lane UFS 3.0, UFS 3.0 2-lane

Clock FrequenciesClock Frequencies
Recommended Maximum Clock Frequency 2840 MHz max. 3091 MHz max.

Cache MemoriesCache Memories
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 2304 Kbyte L2 2304 Kbyte L2
Total L3 Cache 4096 Kbyte L3 4096 Kbyte L3



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 7 nm 7 nm
Semiconductor Technology CMOS CMOS
Number of Transistors Integrated 10300000000
FabPlant which fabricates the semiconductor component TSMC TSMC

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 650 GPU Qualcomm Adreno 650 GPU
GPU Clock 587 MHz GPU 670 MHz GPU

Cellular CommunicationCellular Communication
Supported Cellular Data LinksList of supported cellular data links CSD, GPRS, GPRS C12, GPRS MSC12, GPRS MSC32, GPRS MSC33, EDGE, EDGE MSC10, EDGE MSC12, EDGE MSC32, EDGE MSC33, UMTS, HSUPA, HSUPA 1.4, HSUPA 2.0, HSUPA 5.8, HSUPA 11.5, HSDPA, HSDPA 1.8, HSDPA 3.6, HSDPA 7.2, HSDPA 10.2, HSDPA 14.4, HSPA+ 21.1, HSPA+ 28.8, HSPA+ 42.2, DC-HSDPA 42.2, cdmaOne, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, TD-HSDPA, LTE, LTE 50/25, LTE 75/25, LTE 100/50, LTE 150/50, LTE 225/50, LTE 300/50, LTE 300/75, LTE 300/100, LTE 400/150, LTE 450/50, LTE 450/100, LTE 600/100, LTE 1000/100, LTE 1200/200, LTE 1600, LTE 2400/400, LTE 3000/600, NR 3700, NR 7500 data links CSD, GPRS, GPRS C12, GPRS MSC12, GPRS MSC32, GPRS MSC33, EDGE, EDGE MSC10, EDGE MSC12, EDGE MSC32, EDGE MSC33, UMTS, HSUPA, HSUPA 1.4, HSUPA 2.0, HSUPA 5.8, HSUPA 11.5, HSDPA, HSDPA 1.8, HSDPA 3.6, HSDPA 7.2, HSDPA 10.2, HSDPA 14.4, HSPA+ 21.1, HSPA+ 28.8, HSPA+ 42.2, DC-HSDPA 42.2, cdmaOne, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, TD-HSDPA, LTE, LTE 50/25, LTE 75/25, LTE 100/50, LTE 150/50, LTE 225/50, LTE 300/50, LTE 300/75, LTE 300/100, LTE 400/150, LTE 450/50, LTE 450/100, LTE 600/100, LTE 1000/100, LTE 1200/200, LTE 1600, LTE 2400/400, LTE 3000/600, NR 1500, NR 2600, NR 3700, NR 4600, NR 7500 data links

Additional InformationAdditional Information
Special Features quad Qualcomm Kryo 585 Gold Harvard Superscalar cores (1x ARM Cortex-A77 up to 2.84 GHz, 3x ARM Cortex-A77 up to 2.42 GHz, 1 Mbyte L2 cluster cache) + quad Qualcomm Kryo 585 Silver (4x ARM Cortex-A55 up to 1.8 GHz,.. quad Qualcomm Kryo 585 Gold Harvard Superscalar cores (1x ARM Cortex-A77 up to 3.1 GHz, 3x ARM Cortex-A77 up to 2.4 GHz, 1 Mbyte L2 cluster cache) + quad Qualcomm Kryo 585 Silver (4x ARM Cortex-A55 up to 1.8 GHz,..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2019-12-17 19:36 2020-07-30 08:52

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