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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component MediaTek
Type Dimensity 1050 MT6879
Year Released 2022
FunctionMain function of the component  Multi-core Application Processor with Modem

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8.2-A
Number of processor core(s) 8
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A78 + 6x ARM Cortex-A55 MPcore

BusesBuses: 
Memory Interface(s):   LPDDR4x SDRAM , LPDDR5 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 2133 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 16 bit
Number of data bus channels 4 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 34.13 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  UFS 2.1UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface , UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 2500 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 64 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 64 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1280 Kbyte L2
Total L3 Cache 2048 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 6 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). ARM Mali-G610 GPU
Number of GPU cores 3-core GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  CSD 9.6 kbpsCircuit Switched Data (CSD) is the original data link protocol of GSM. Up to 9600bit/s download speed , GPRS (Class unspecified)General Packet Radio Service , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTS 384 kbps (W-CDMA)Universal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPA (Cat. unspecified)High-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 1.46 Mbps (Cat. 2) , HSUPA 2.0 Mbps (Cat. 5) , HSUPA 5.76 Mbps (Cat. 6) , HSUPA 11.5 Mbps (Cat. 7) , HSDPA (Cat. unspecified)High-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSDPA 1.8 Mbps (Cat. 4) , HSDPA 3.6 Mbps (Cat. 6) , HSDPA 7.2 Mbps (Cat. 8) , HSDPA 10.2 Mbps (Cat. 9) , HSDPA 14.4 Mbps (Cat. 10) , HSPA+ 21.1 Mbps (Cat. 18) , HSPA+ 42.2 Mbps (Cat. 20)Single-carrier HSPA+ 42.2 Mbps , DC-HSDPA 42.2 Mbps (Cat. 24)Dual-carrier HSPA+ 42.2 Mbps , CDMA2000 1xRTT (IS-2000) , CDMA2000 1xEV-DO Rel. 0 , CDMA2000 1xEV-DO Revision A , TD-SCDMATime Division Synchronous Code Division Multiple Access is the implementation of UMTS  (3G) cellular network in China. , LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 100 Mbps / 50 Mbps (Cat. 3)LTE 100.8 Mbps / 50.4 Mbps (Cat. 3) , LTE 150 Mbps / 50 Mbps (Cat. 4)LTE 151.2 Mbps / 50.4 Mbps (Cat. 4) , LTE 300 Mbps / 50 Mbps (Cat. 6)More exact values: LTE 301.5 Mbps / 50.4 Mbps (Cat. 6) , LTE 300 Mbps / 100 Mbps (Cat. 7)More exact values: LTE 301.5 Mbps / 100.8 Mbps (Cat. 7) , LTE 400 Mbps / 150 Mbps (LTE Cat. 13)LTE Category 13: 391.7 Mbps downlink, 150.8 Mbps uplink (rel. 12) , LTE 600 Mbps / 100 Mbps (LTE Cat. 12)LTE Category 12: 603 Mbps downlink, 102 Mbps uplink (Rel. 11) , LTE 1.6 Gbps (LTE Cat. 19)LTE category 19, 1566 Mbps downlink, 8 CA (Rel. 13) , NR 2.6 Gbps5G NR approx. 2.6 Gbps downlink (FR1, Sub6) , NR 3.7 Gbps5G NR approx. 3.7 Gbps downlink , NR 4.6 Gbps5G NR approx. 4.6 Gbps downlink data links

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   Yes
Supported Galileo service(s)Galileo is a global satellite  navigation system operated by European Union and the European Space Agency.  E1Galileo E1 band centered at 1575.42  MHz and with a reference bandwidth of 24.552 MHz, uses the Composite Binary Offset Carrier (CBOC) modulation , E5aGalileo E5a band centered at 1176.45MHz, uses QPSK(10) modulation
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation. , L2OFGLONASS L2OF FDMA signal centered at 1246 MHz, features a BPSK(0.5) modulation
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation , B2aBeiDou-3 B2a signals, transmitted by Medium Earth Orbit (MEO) satellites and the Inclined GeoSynchronous Orbit (IGSO) satellites of BDS-3, are centered at 1176.45 MHz BeiDou receiver

Additional InformationAdditional Information: 
Special Features
2x ARM Cortex-A78 (up to 2.5 GHz, 128 Kbyte L1 cache per core, 256 Kbyte L2 cache per core) + 6x ARM Cortex-A55 (up to 2 GHz, 64 Kbyte L1 cache per core, 128 Kbyte L2 cache per core) Harvard Superscalar processor core, HMP, integrated GSM / GPRS / UMTS / DC-HSPA / HSUPA / TD-SCDMA 2.8 Mbps / CDMA2000 1xRTT EV-DO Rev. A / LTE / 5G NR 4.7 / 2.5 Gbps baseband modem, 144 Hz 2520x1080 display support, 5G NR dual-SIM support, 2160p 60 fps HDR10 video encode, 2160p 60 fps HDR10 video decode, Bluetooth 5.2, FM radio support, 32 + 16 MP dual / 108 MP single camera support. MediaTek MiraVision 760, MediaTek HyperEngine 5.0, AI Accelerator, APU 550. Wi.Fi 6 support, OpenCL 2.0, OpenGL ES 3.2, DirectX 12, Vulkan 1.1. For smartphone devices.

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2022-10-03 11:18
 
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