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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Apple
Type A16 Bionic APL1010 / APL1W10
Codename T8120
Year Released 2022
FunctionMain function of the component  Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8.6-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 2x Apple Everest + 4x Apple Sawtooth cores
Number of processor core(s) hexa-core

BusesBuses: 
Memory Interface(s):   LPDDR4x SDRAM , LPDDR5 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 3200 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 102.4 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface , SATASATA revision 1.0 (2003) offering 1.5 Gbit/s data rate , SATA IISerial AT Attachment revision 2.0 (released in 2004) or 2.x offering 3 Gbit/s data rate , UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface , UFS 3.1 2-laneComplies with dual-lane Universal Flash Storage 3.1 revision offering 2.9 GB/s NAND flash data rate


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 3460 MHz max.

Cache MemoriesCache Memories: 
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 20480 Kbyte L2
Total L3 Cache 24576 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 5 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
Number of Transistors Integrated 16000000000
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Apple A16 GPU
Number of GPU cores 5-core GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Additional InformationAdditional Information: 
Special Features
2x high-performance Apple Everest 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores (up to 3.46 GHz, 8 MiB L2 cache per core) + 4x high-efficiency Apple Sawtooth 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores (up to 2.02 GHz, 1 MiB L2.. ››

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2022-09-10 15:55
 
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