Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 210 MSM8209 |
Year Released: |
2014 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
32 bit |
Supported Instruction Set(s): |
ARMv7-A |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A7 MPcore |
Number of processor core(s): |
quad-core |
Buses:
|
Memory Interface(s): |
LPDDR2 SDRAM
, LPDDR3 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
533 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
1 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
4.26 Gbyte/s |
Non-volatile Memory Interface |
eMMC 4.5![Complies with embedded MMC 4.5 specification released in 2011 Complies with embedded MMC 4.5 specification released in 2011](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1100 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
28 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 304 GPU |
GPU Clock: |
400 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
GPRS
, EDGE
, UMTS
, HSUPA
, HSDPA
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A data links |
Additional Information:
|
Special Features: 4x ARM Cortex-A7 processor cores, Hexagon QDSP6, CDMA 2000 1x Adv./DO Rel 0., Rev. A, GPRS, EDGE, W-CDMA/UMTS, HSDPA, HSUPA baseband support, OpenGL ES 3.0, OpenCL 1.1, OpenVG 1.1, DirectX 11, dual SIM / dual standby support (DSDS), 1280x720 display.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2015-09-04 11:02 |