Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 810 APQ8094 |
Year Released: |
2015 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
4x ARM Cortex-A57 MPcore + 4x ARM Cortex-A53 MPcore |
Buses:
|
Memory Interface(s): |
mobile (LP) DDR4 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
64 bit |
Number of data bus channels: |
1 ch |
Non-volatile Memory Interface |
eMMC 5.0![Since 2013 Since 2013](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Minimum Clock Frequency: |
200 MHz min. |
Recommended Maximum Clock Frequency: |
1958 MHz max. |
Cache Memories:
|
Total L2 Cache![Capacity of level 2 cache shared between processor core(s) Capacity of level 2 cache shared between processor core(s)](icons/10x10/info_gray.gif) |
4096 Kbyte L2 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
20 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 430 GPU |
GPU Clock: |
500 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported GLONASS protocol(s) |
Yes |
Additional Information:
|
Special Features: Octa-core ARM big.LITTLE architecture, quad 64-bit ARM Cortex-A57 MPcore Harvard Superscalar cores (up to 1958 MHz) + quad 64-bit ARM Cortex-A53 MPcore Harvard Superscalar cores (up to 1555 MHz), HMP, 1600 MHz dual-channel 64-bit LP-DDR4 SDRAM interface, eMMC 5.0 interface, Hexagon QDSP6, 500 MHz Qualcomm Adreno 430 GPU, 2560x2048 display support, 2160p video encode/decode, Qualcomm IZat GPS+Glonass, Bluetooth 4.1, OpenCL 1.2, OpenGL ES 3.0, DirectX 11.1, Qualcomm VIVE 802.11ac, USB 3.0, Renderscript Compute, FlexRender support, 12-bit dual Image Signal Processors, 55 MP camera support, HDMI 1.4 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2015-03-04 18:59 |