PhoneDB - infinitely detailed




FacebookGoogle PlusRSS FeedTwitter

Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon 400 MSM8930AB
Codename Snapdragon 400
Year Released 2013
FunctionMain function of the component  Multi-core Application Processor with Modem

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 11 pipeline stages
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x Qualcomm Krait 300

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR2 SDRAM , mobile (LP) DDR3 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 533 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 1 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 4.26 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  eMMC 4.5


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 1728 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1024 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 305 GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  CSD 9.6 kbpsCircuit Switched Data (CSD) is the original data link protocol of GSM. Up to 9600bit/s download speed , GPRS (Class unspecified)General Packet Radio Service , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTS 384 kbps (W-CDMA)Universal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPA (Cat. unspecified)High-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 5.76 Mbps (Cat. 6) , HSDPA (Cat. unspecified)High-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , DC-HSDPA 42.2 Mbps (Cat. 24)Dual-carrier HSPA+ 42.2 Mbps , CDMA2000 1xRTT (IS-2000) , CDMA2000 1xEV-DO Rel. 0 , CDMA2000 1xEV-DO Revision A , CDMA2000 1xEV-DO Revision B , TD-SCDMATime Division Synchronous Code Division Multiple Access is the implementation of UMTS  (3G) cellular network in China. , LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). data links

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   Yes
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes

Additional InformationAdditional Information: 
Special Features
dual Qualcomm Krait 300 Harvard Superscalar core, Hexagon QDSP6V4 500MHz, CDMA 2000 1x Adv./DO Rel 0., Rev. A/B, SVDO-DB, GSM, GPRS, EDGE, UMTS, HSDPA, HSUPA, HSPA+, LTE FDD/TDD CAT 3, SVLTE-DB, Rel9 DC-HSPA+, TD-SCDMA baseband modem, dual SIM / dual standby support, 720p display support, 20 MP camera support, 1080p video encode/decode, gpsOneGen 8A with GLONASS. Snapdragon 400 Processors are designed to deliver the performance, features, connectivity and battery life that consumers expect in high volume smartphones and tablets.

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2013-03-02 12:57
 
You are here: Processor Specs \ Qualcomm Snapdragon 400 MSM8930AB (Snapdragon 400) datasheet